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Home » NEWEST Products » New by Manufacturer » EPCOS » EPCOS CeraLink Capacitors
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EPCOS CeraLink™ Capacitors

EPCOS CeraLink™ Capacitors feature the newly patented antiferroelectric capacitor technology which is based on a material that exhibits capacitance increase with increasing voltage. This capability makes Ceralink ideal for snubber applications.

Overview


EPCOS CeraLink™ Capacitors

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Voted High-Performance Component of the Year


Annual Creativity in Electronics (ACE) Award
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Featuring the newly patented antiferroelectric capacitor technology,  EPCOS CeraLink™ Capacitors exhibit an increase in capacitance when voltage increases.


CeraLink Capacitance to Voltage Graph

EPCOS Capacitance to Voltage Graph

CeraLink™ supports higher switching frequencies and the use of lower-cost, more robust semiconductors (e.g. high speed IGBT versus MOSFET) through its extremely low ESL and ESR properties. Features such as significantly lower manufacturing complexity,  chip areas that are often smaller than superjunction MOSFETs, and high switching frequencies give the latest IGBTs an excellent price-performance ratio. The cost of this type of solution is one third lower than a MOSFET solution. Furthermore, capacitor value, board space, magnetics, heat sink and so on will also significantly shrink so that the Total Cost of Solution (TCS) could be reduced by more than 40%.

When used for system integration only, CeraLink™ reduces the risk that semiconductors are damaged by peak overvoltages caused by the system approach. The snubber function will keep the semiconductors in the Safe Operating Area. Integration withstands any malfunction of applying DC-Link Capacitors (DCL) caused by a user.

New Patented System Solution

Ceralink's multilayer construction featuring a newly designed ceramic material in combination with copper inner electrodes offer economic and performance advantages.

Advantages
  • ESR decreases drastically with temperature
  • Extremely low ESL
  • Cu inner electrode material properties are beneficial for high frequency switching with low losses and allow fast slew rates with a high Imax
  • Suitable for switching frequencies up to and above 1 MHz!
  • Wide operating temperature range up to 150°C (also for suitable for SiC/GaN!)
  • Low losses at high frequencies
  • Supports fast-switching semiconductor
  • Supports further miniaturization of power electronics on the system level

  • Ultra low leakage currents due to material selection
  • With increasing frequencies the dielectric losses are decreasing
  • Terminals for solder and for modern fast Press-Fit technology
  • No negative DC-Bias reducing the capacitance (up to VOP)
  • Compact housing with options for typical power modules for industrial and automotive applications i.e. zero-defects conception
  • Special types for integration into power modules (IGBT/MOSFET/SiC)
  • Traceability through QR-Codes possible (design dependent)

Features
  • High capacitance density
  • Extremely low ESR and low ESL
  • High current density, effective ripple voltage reduction capability
  • Increasing effective capacitance with rising voltage
  • Capable for high temperature excursions
  • Low losses at high frequencies
  • Supports fast-switching semiconductor
  • Supports further miniaturization of power electronics on the system level
Specifications
  • Insulation resistance: 1 GΩ to 10 GΩ very high, thus resulting in a very low leakage current, especially at high temperatures
  • ESL: <4 nH and thus extremely low
  • ESR: <4 mΩ and thus extremely low even at low capacitances, resulting in low losses (typical)
  • Operating temperature: -40°C to +125°C (for short periods up to +150°C), thus also suitable for SiC

Portfolio

EPCOS CeraLink™ Capacitors are available in several versions with capacitance range from 1 µF to 100 µF at rated voltages of 400 VDC and 800 VDC. These versions include CeraLink™ LP (Low Profile), CeraLink SMD (Surface Mounted Device), CeraLink™ SP (Solder Pin), CeraLink™ PF (Press-Fit), and CeraLink™ PFBB (Press-Fit Bus Bar).


CeraLink™ SP and PF are designed as standard platform series offering either solder or press-fit pinning.
EPCOS Ceralink LP and SMD


    EPCOS CeraLink SP and PF
   
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CeraLink™ SP and PF
– Dimensions*
EOCIS CeraLink SP and PF Dimensions


CeraLink™ LP and SMD
are designed for system integration in semiconductor modules or as external snubber. CeraLink LP and SMD Specifications   EPCOS CeraLink LP and SMD





CeraLink™ LP (Low Profile) – Dimensions*
EPCOS CeraLink LP Dimensions
CeraLink™ SMD (Surface Mounted Device) – Dimensions*
EPCOS CeraLink SMD Dimensions


CeraLink™ PFBB features devices directly adopted to semiconductor modules. EPCOS Ceralink PFBB
  
EPCOS CeraLink PFBB Series
CeraLink™ PFBB
– Dimensions*

EPCOS Ceralink PFBB Dimesions

* Dimensions in mm. Changes without further notice!

Graphs

Lowest Z,ESR for the 10/20µF 400VDC device

Ceralink's combination of high capacitance per volume, low ESL, low ESR and low leakage losses allows a revolution in IGBT inverter designs.

EPCOS Ceralink Lowest Z,ESR for the 10/20µF 400VDC device

Lowest Z,ESR for the 0.5/1.0µF 400VDC device

Ceralink's combination of high capacitance per volume, low ESL, low ESR and low leakage losses allows a revolution in IGBT inverter designs.

EPCOS Ceralink Lowest Z,ESR for the 0.5/1.0µF 400VDC device

Outstanding ESR Performance at High Temperatures


EPCOS Ceralink ESR Performance at High Temperatures

Ultimate High Charging Properties at High Frequencies

The C x ESR value with approx.25-30 nsec for the 10/20µF device allows ultra fast charging/discharging. The system solution benefits from the low serial resistance of the  Cu inner electrode construction and together with the low ESL. This enables the semiconductors to be operated at higher frequencies with high slew rates.

EPCOS Ceralink Ultimate High Charging Properties at High Frequencies

Low Leakage Currents (Isolation)-Aging-Degradation

The key measurement figure for power electronics is the materials constant and its temperature dependence. Due to its structure the CeraLink™ is superior to existing ceramic systems and therefore outstanding aging properties can be expected.

EPCOS Ceralink Low Leakage Currents (Isolation)-Aging-Degradation

Applications

New Power for DC-Link Capacitors – CeraLink™

New Power for DC-Link Capacitors – CeraLink™

Typical DC-AC Inverter

Application – High Power Converter for Electrical Propulsion

EPCOS Ceralink Application – High Power Converter for Electrical Propulsion

Usage of CeraLink™- Series

EPCOS Usage of CeraLink™- Series

Application – High Power Inverter for DC-DC

EPCOS Ceralink Application – High Power Inverter for DC-DC

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  • Passive Components|Capacitors