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Home » NEWEST Products » New by Manufacturer » Amphenol » Amphenol NeXLev® Board-to-Board Connectors
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Amphenol NexLev®
Board-to-Board Connectors

High-Density Parallel Board-to-Board Connectors

Amphenol TCS' NeXLev® product line features High-Density Parallel Board-to-Board Connectors capable of handling data rates up to 12.5 Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design of the Amphenol TCS NeXLev High-Density Parallel Board-to-Board Connectors includes up to 57 real signals per linear centimeter (145 signals per linear inch), ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.

Amphenol TCS NeXLev® High-Density Parallel Board-to-Board Connectors



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Features
  • Data rates of up to 12.5 Gbps
  • Rugged wafer construction
  • Enhanced BGA attachment process to increase SMT process yields
  • Range of stacking heights from 10mm-33mm
  • RoHS compliant
  • Up to 57 real signals per linear centimeter (145 signals per linear inch)
  • Power can be run through both the signal contact and shield side of the wafer
Amphenol TCS NexLev Compliance
Electrical Specifications
  • Low-Level Contact Resistance: 20 milliohms maximum
  • Dielectric Withstanding Voltage: 600 Megohms duty
  • Insulation Resistance: 600 Megohms duty
  • Signal Current Contact Rating: 1.0 A continuous duty
  • Shield Contact Current Ratings: 1.0 A continuous duty
  • Signal Integrity Targets: <5% crosstalk, <5% Vr @ 250 picosecond Tr, single-ended <5% crosstalk, <5% Vr @ 150 picosecond Tr, differential

Mechanical Specifications
  • Wipe: 1,0mm minimum
  • Contact Normal Force: 0,35N (35 grams) minimum
  • Contact Mating Force: 0,45N per signal. (300 I/O module = 135N) (approximately 30 lb.)
  • Durability: 100 cycles, minimum

Physical Specifications
  • Insulators: Glass-reinforced polyester (Liquid Crystal Polymer). UL 94V-0; color black or gray
  • Signal Contacts: 0.15mm-thick copper alloy per CDA 17110.
  • Ball Grid Termination: 0.75mm dia. Eutectic 63/37 Sn-Pb.

Single-Ended

In the single-ended configuration, NeXLev provides up to 57 usable signals per linear centimeter (145 per linear inch). In this configuration NeXLev can operate up to 200 picoseconds (20-80%) with less than 5% multi-line crosstalk and less than 5% reflection across the full range of heights from 10-33mm. Signal performance can be further increased with the additional grounding of signal pins.

  • Less than 3% multi-line crosstalk at a rise time of 100 picoseconds (20-80%) can be achieved when using a staggered 1:1 grounding of the signals, changing the effective density of the connector to 28.5 signals per linear centimeter (73 signals per linear inch).
  • Achieve less than 2% multi-line crosstalk at a rise time of 100 picoseconds (20-80%) by grounding the outer rows of signals, changing the effective density of the connector to 23 signals per linear centimeter (58 signals per linear inch).

Differential

In the differential configuration, NeXLev provides up to 29 real signal pairs per linear centimeter (73 pairs per linear inch). In this configuration NeXLev operates at a rise time of 100 picoseconds (20-80%) with less than 5% multi-line crosstalk and 5% reflections across the full range of stacking heights.

  • Achieve enhanced performance at a rise time of 50 picoseconds (20-80%) with less than 5% multi-line crosstalk by modifying the ground pattern to three differential pairs per wafer (G-S-S-G-S-S-G-S-S-G). This changes the effective density of the connector to 17 pairs per centimeter (44 pairs per inch).




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