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Molex iPass+™

HSC CXP Interconnect System

Molex introduces the iPass+ ™ HSC CXP Interconnect System leverages high-speed wafer technology and compliant pin tails to provide a higher density, 12-channel connector system capable of achieving Quad Data Rates (QDR) of 10 Gbps. The Molex iPass+ Copper Cable Assemblies are designed to accommodate single, ganged, or stacked connector configurations in extremely high-density applications. The dual paddle-card design is cost effective and each cable port is capable of up to 120 Gbps.

• One-piece integrated press-fit connector and cage provides one-step placement to PCB, lowering board processing time
• Four integral screw-mount hold downs applied from the bottom of the PCB provide optimal retention of the die-cast assembly to PCB without taking up additional board real estate
• Low-profile height 11.88mm (.468") complies with standard and low-profile PCIe add-in card component height
• Two robust guide pins located on each side of the assembly ensures compliant-pin integrity during alignment to PCB
• Front elastomeric gasket and electro magnetic interference (EMI) protection fingers provide optimized EMI protection to face plate
• Ground-pad alleys located at the rear of the die-cast assembly provide ease of routing off the top layers of the PCB
  

• High-Performance Computing
• Controller cards and servers
• Switches
• Direct Attached Storage (DAS)
• Data Centers
• Controller cards and servers
• Switches
• Blades
• Storage Attached Networks (SAN)
• Networking
• NIC cards and servers
• Switches
• Routers
• Network Attached Storage (NAS)
• Electrical
• Voltage (max): 30V
• Current (max): 0.5A
• Dielectric Withstanding Voltage: 500V DC
• Insulation Resistance: 1000 Megohms
• Mechanical
• Insertion Force to PCB: 25N (5.62 lbf) per pin max
• Mating Force: 210N (47.21lb) min.
• Unmating Force: 42N (9.44 lb) min.
• Durability (min.): 250 cycles

• Built to CXP specifications to be compliant up to QDR speeds per InfiniBand Architecture Specification Volume 2, 1.2.1
• Dual paddle-card design provides cost-effective, high-density solution; each cable port is capable of up to 120 Gbps
• Zinc die-cast back shells on cable plug provides 360º electro magnetic interference (EMI) signal shielding
• Ergonomic "pull-to-release" latching system enables low-impact cable disengagement
• Supports serial ID functionality allowing individual cable identification
• Hot pluggable cable allows insertion and removal of plug without powering down the system
  

• Mechanical
• Mating Force: 210N (47.21 lb) min.
• Unmating Force: 42N (9.44 lb) min.
• Durability (min.): 250 cycles
  

• Electrical
• Voltage (max.): 30V AC
• Current (max.): 0.5A