Molex, established in 1938, is one of the world's largest global manufacturers of interconnect products. Molex creates innovative product solutions for wire-to-wire, wire-to-board, and board-to-board connectors, including header, backplane, terminal, telecom, ethernet, and cable, as well as application tooling. Molex's efforts to minimize the environmental impacts of business activities, products, and services are reflected in their commitment to their environment management system, ECOCARE.
For more Molex products, visit Temp-Flex Cable, manufacturer of specialty wire & cable typically used in markets with extreme conditions and harsh environments.
For more Molex products, visit FCT Electronics, manufacturer of electrical connectors and associated products for the electronics industry.
Molex Micro-Lock™ 1.25mm Pitch SMT Wire-to-Board System offers the smallest overall size and highest current-carrying capability of any similar pitch positive-lock system, while also providing a wide range of mating configurations and superior pin and terminal protection. The Micro-Lock 1.25mm pitch system is available in single and dual rows in both straight and right-angle configurations and is ideal for any application that requires space savings and mating variation. Molex Micro-Lock 1.25mm pitch system offers many of the same features as Molex's Micro-Lock 2.00mm pitch system, but the Micro-Lock 1.25 system is about 75% smaller and is rated at 1.5A versus 3.0A for Micro-Lock 2.0. The Micro-Lock 1.25mm family is available in 2-16 circuits for single row and 16-40 circuits for dual row. The system offers low-halogen material not only for connectors, but also in the wire-harness material used. This Molex positive-lock system is ideal for use in a variety of applications, including data communications, gaming, lighting, medical, car electronics, consumer, and network/telecom.
Molex PoE+ Enabled Gigabit Magnetic Jacks with LEDs support Gigabit Ethernet connectivity in accordance with IEEE802.3ab and deliver up to 30W of power to networked devices. The 85732 series (12-port) and 85735 (8-port) PoE+ Enabled Gigabit Magnetic Jacks with integrated gigabit magnetics are designed for use in high port-count gigabit switches and routers and extend Molex's product offering for multi-port magnetic jacks to meet a wider range of customer applications.
Molex VITA 66.1 Ruggedized Optical MT Backplane Connector System simplifies installation and maintenance of rugged embedded VPX MIL/AERO backplane applications. The patent-pending MT ferrule-carrier design enables field servicing without the use of hand tools. The design allows the system to blind-mate backplane applications requiring optically robust interfaces with simple accessibility and streamline MT assembly installation or regular maintenance. Compliant with ANSI-ratified VITA 66.1 specification for VPX
architecture, the system's MT termini are available in 8, 12 or 24 fibers in standard multimode and singlemode or VersaBeam™ (expanded beam MT). The system supports up to two floating MT ferrules (termini) to aid in proper mating of blind-mate applications. With its robust housing with heavy-duty anodized aluminum construction, ability to withstand extreme temperature ranges, and VITA 66.1 compliant footprint, the Molex VITA 66.1 Ruggedized Optical MT Backplane Connector System is ideal for rugged military and non-automotive commercial applications.
Molex Ultra-Fit™ Power Connectors alleviates same-circuit-size cross mating and reduces terminal backout occurrences. The space saving, low mating force, high power Ultra-Fit power connector has a 11A current rating, 3.5mm pitch and is available with color keying options. A streamlined design up to 20% smaller over similar power connectors provides space savings and an ultra-low mating force reduces operator fatigue when mating numerous high-circuit connectors.
Molex Vertical SMT Modular Jacks with Kapton Tape for vacuum pick-and-place functionality can streamline high-volume PCB production and lower manufacturing costs. Automatic vacuum pick-and-place is the most common high-speed manufacturing process for precision placement of surface mount components on PCBs in mass production. The addition of Kapton tape to the surface of Molex Vertical SMT Modular Jacks facilitates automatic vacuum pick-and-place of the connector alongside other SMT components. This streamlines high-volume production and lowers manufacturing costs for customers. These Molex modular jacks are ideal for use in a variety of networking, commercial, consumer office, medical, and industrial applications.
Molex iPass+™ zHD Vertical Connectors operate at SAS-3 and Projected SAS-4 high-speed bandwidths. These low-profile Molex connectors drive next generation data rates and port densities, improving system airflow and signal integrity by eliminating mid-plane connections. Molex iPass+ zHD Connectors are 0.75mm pitch vertical connectors feature a robust and secure connection and are scalable up to 96Gbps data rates (24Gbps over four lanes). The vertical press-fit iPass+ zHD connector nearly doubles the number of ports on the PCB compared to conventional iPass connectors. One-step placement reduces cost and time associated with the wave solder process. These iPass+ zHD connectors mate to all current miniSAS HD (Molex iPass+ HD) passive copper, active copper, and optical cable assemblies. A positive locking latch ensures secure mating retention to cable assemblies. Available in multiple configurations (1-by-1, 1-by-2, 1-by-4), these versatile press-fit iPass+ zHD connectors accommodate a range of high density data and networking applications.
Molex IllumiMate™ 1.25mm Pitch Wire-to-Board Connector System is designed to meet the low-power needs of thin-screen LED TVs. Molex 1.25mm connectors offer more mating styles, voltage ratings, circuit sizes, and locking types than any similar connector system. These IllumiMate wire-to-board connectors offer straight and right-angle headers with friction and positive locks in various circuit sizes. The inner locks save space, protect wires from tangling, and latches from breaking. Fully shrouded headers with guiding features protect pins from damage and facilitate mating. Positive locks provide secure latching when needed, while friction locks on some versions provide additional mating stability. These 1.25mm connectors feature a dual-beam terminal design for secure electrical contact, front solder tabs for strong PCB retention, and polarizing ribs between circuits in the header that facilitate mating and protect contacts. Both vertical and right-angle headers accommodate vacuum pick-and-place equipment in RoHS-compliant and low halogen material to meet global environmental requirements.
Molex IllumiMate™ 1.00mm Pitch Wire-to-Board Connector System saves about 50% of space compared to IllumiMate 1.25 Connectors to meet the demands of thinner screen designs. Molex IllumiMate 1.00mm Connectors also offer lower voltage options than the IllumiMate 1.25 range to help achieve lower power consumption. IllumiMate 1.00mm Connectors feature positive and friction locks for secure latching, guide ribs to facilitate mating and prevent housing movement, front solder tabs for strong PCB retention, and a dual-contact terminal design for electrical contact assurance. The combination of small size and various circuit size and voltage options provide unique advantages and a single footprint design for any application that may include various models with different functionalities. These Molex wire-to-board connectors are ideal for use in a variety of markets and applications, including consumer electronics (LED TVs and mobile games), personal computers (desktop LED monitors, notebooks, and tablets), and medical (diagnostic and radiology equipment).
Molex MX150 CE™ Sealed Wire-to-Wire Interconnects are the most robust, rugged wire-sealed connector system. Designed for superior value, MX150 CE Sealed Connectors are ideal for light-vehicle applications not requiring USCAR specifications. Molex MX150 CE connectors are designed to operate reliably under harsh environmental and geological conditions where vast travel distances, rugged terrain, poor road conditions, and extreme weather temperatures are expected. The series is highly compact, featuring a 43.95mm mated interconnect length. These interconnects also feature individual wire seals, ensuring IP6K9K-level protection of the entire wired assembly from end-to-end. The series supports up to 12.0A current per blade, making it suitable for high- and low-current applications.
Molex EXTreme Ten60Power™ High-Current Connectors are hybrid power and signal devices that achieve up to 260.0A per linear inch and faster response times. EXTreme Ten60Power High-Current Connectors are designed for applications that require high current density and low power loss. Designed as a higher-current and lower profile power interconnect than existing connectors, Molex EXTreme Ten60Power provides maximum current-to-length ratio packaged in a low-profile, 10.00mm height housing that enhances system airflow within the power system. Both the plug and receptacle utilize reliable, proven Molex power and signal contact designs.
Molex EXTreme OrthoPower™ Orthogonal Direct-Power Connector System delivers 60.0A via split-blade technology, providing dedicated 60.0A current via 30.0A in-and-out routing through a dense power interconnect. Molex EXTreme OrthoPower Connector System solves the networking and telecommunications challenge of routing power to backplane line cards. This orthogonal direct-power connector system uses a dedicated power card to power each line card for 30.0A in-and-out routing, totaling 60.0A per module. This configuration provides cost savings by eliminating power routing through orthogonal direct backplane connectors. These connectors utilize proven technology from the Molex EXTreme LPHPower™ and EXTreme Ten60Power™ High-Current Connector systems.
Molex SL™ (Stackable Linear) Modular Connectors lead the consumer electronics and automotive industries with the largest number of variations and cabling configurations. The SL series includes new surface mount headers for low-power and signal wire-to-board and wire-to-wire applications. The comprehensive SL Modular Connector System includes: press-fit compliant-pin, low-profile, latching vertical and right-angle headers; five stackable, low-profile housings for male or female crimp terminals; pre-assembled, single-piece pin and receptacle connector assemblies for IDT termination of discrete wire or ribbon cable and piercing crimp termination of FFC/FPC; single- and dual-row latching interim clips for stacking of sub-assemblies to form larger connectors; and panel mounts for modular wire-to-wire remote interconnections. SL products are capable of mating with select C-Grid® and KK® products. This product family is suitable for low-power signal applications such as computers, medical instruments, and automotive controls.
Molex 89762 Flexible Microwave Cable Assemblies deliver high performance with proven cable technology and connector termination expertise. These Molex high-performance, flexible microwave cable assemblies replace stiff and difficult-to-install semi-rigid assemblies.The flexible microwave cables are constructed from Temp-Flex® coaxial cables and Molex RF connectors and offer excellent electrical properties while minimizing Voltage Standing Wave Ration (VSWR) and insertion loss for the ideal cable and connector combination. Connector options include SMA, 2.92, SMP, SMPM, and others.
Molex Nano-SIM Card Sockets feature superior reliability for smartphones and tablet devices and are designed to mate seamlessly with standard Nano-SIM and specially-fitted micro-SIM cards. Molex Nano-SIM Card Sockets have a card socket shell with a 1.30mm profile height to enable use of the standard height (0.67mm) Nano-SIM cards as well as the thicker (0.76mm) specially-fitted micro-SIM cards. This card socket series is used with a 0.30mm block-style SIM connector (series 78545) to provide a high contact normal force (0.30N) that ensures card-to-socket contact integrity and electrical reliability. The 3-piece socket design with its separate block-style SIM connector and the ejector tray lowers the risk of SMT warpage, especially during high IR-processing temperatures. This compact set of components includes card polarization and detection as well as tray-locking features.
Molex zQuad Small Form-factor Pluggable Plus (zQSFP+TM)
interconnect solution is designed for high-density interconnect
applications and conforms to SFF-8665 QSFP28. Components of the system
include SMT connectors; and stacked integrated 2-by-1, 2-by-2 and 2-by-3
connectors and cages. Molex's zQSFP+TM SMT connector
supports new 100 Gbps Ethernet and 100 Gbps InfiniBand* (IB) Enhanced
Data Rate (EDR) applications. EDR applications consist of four lanes of
high-speed differential signals with individual data rates at 25 Gbps.
The preferential coupling design uses a narrow-edge coupled, blanked-
and formed-contact geometry and insert molding to optimize electrical
performance. The zQSFP+TM connector shares the same mating
interface as the QSFP+ form factor, making it backward compatible with
current connectors, cages and cable assemblies. zQSFP+TM EMI
cages are designed with an advanced heat-sink system to provide a high
level of heat dissipation for next-generation system-power levels.
Die-cast design features screw-down option to the PCB for maximum board
retention. The spring-finger design provides optimal EMI grounding and
allow for more space to route high-speed traces.