Molex, established in 1938, is one of the world's largest global manufacturers of interconnect products. Molex creates innovative product solutions for wire-to-wire, wire-to-board, and board-to-board connectors, including header, backplane, terminal, telecom, ethernet, and cable, as well as application tooling. Molex's efforts to minimize the environmental impacts of business activities, products, and services are reflected in their commitment to their environment management system, ECOCARE.
For more Molex products, visit Temp-Flex Cable, manufacturer of specialty wire & cable typically used in markets with extreme conditions and harsh environments.
For more Molex products, visit FCT Electronics, manufacturer of electrical connectors and associated products for the electronics industry.
Molex zQuad Small Form-factor Pluggable Plus (zQSFP+)
interconnect solution is designed for high-density interconnect
applications and conforms to SFF-8665 QSFP28. Components of the system
include SMT connectors; and stacked integrated 2-by-1, 2-by-2 and 2-by-3
connectors and cages. Molex’s zQSFP+ SMT connector supports new 100
Gbps Ethernet and 100 Gbps InfiniBand* (IB) Enhanced Data Rate (EDR)
applications. EDR applications consist of four lanes of high-speed
differential signals with individual data rates at 25 Gbps. The
preferential coupling design uses a narrow-edge coupled, blanked- and
formed-contact geometry and insert molding to optimize electrical
performance. The zQSFP+ connector shares the same mating interface as
the QSFP+ form factor, making it backward compatible with current
connectors, cages and cable assemblies. zQSFP+ EMI cages are designed
with an advanced heat-sink system to provide a high level of heat
dissipation for next-generation system-power levels. Die-cast design
features screw-down option to the PCB for maximum board retention. The
spring-finger design provides optimal EMI grounding and allow for more
space to route high-speed traces.
Molex DDR4 DIMM Sockets are designed for the latest generation of DDR/SDRAM in DIMM format. DDR4 products offer a 100% increase in speed, a 30% increase in density, and a 20% decrease in required voltage compared to other DDR/SDRAM offerings. These DIMM sockets support UDIMM, RDIMM, and LRDIMM memory applications over a wide range of high-speed data, computing, telecommunication, and networking servers with a data speed of 3.2 billion transfers per second. Molex DDR4 DIMM sockets have a vertical, through-hole (78726) or vertical, SMT (78730) design and feature 288 circuits, 30µm gold plating, and a reduced connector footprint of 6.50mm (max). Other hallmarks of Molex DDR4 sockets include high dimensional stability and excellent compatibility in Halogen-free and lead-free technologies.
Molex Optical EMI Shielding Adapters are designed to address
mechanical-design requirements limiting EMI and Radio Frequency
Interference (RFI) emissions from front panels or enclosures. The
adapters are constructed of either all die-cast housings or as a half
die-cast, half polymer housing. Housings have an EMI gasket that seals
the adapters to the panel. EMI adapters increase the shielding
effectiveness while enhancing the front panel aesthetics compared to
traditional plastic adapters. Molex’s extensive EMI shielding adapters
include LC, SC and MTP/MPO, which include Universal, Multi-Format and
Molex Super Sabre™ is a high-current, power interconnect system designed for a wide range of applications requiring flexible configurations. Features include a flat blade terminal design with four points of electrical contact, fully isolated terminals on both mating sides, positive latch and TPA features (Terminal Position Assurance), silver-plated interface, and an optional UL1950 "Finger Test" certified blade. Super Sabre provides 30.0A per blade and 600V with a variety of power and power/signal options. The system's unique option of power and signal combinations enables designers to use a single connector housing to mate high-current and low current power (under 5.0A) while reducing size and cost of the total interconnect package. Super Sabre is well-suited for networking & telecommunications, appliances / white goods, automotive, power supplies for 100 to 600W units, and medical applications.
Molex Woodhead® MAX-LOC® Plus Shielded Cord-Grip Assemblies connect high-power electrical cables directly to an application via an exterior mounting enclosure, simplifying the installation process for high-volume, cost-sensitive programs. MAX-LOC® Plus Shielded Cord-Grip Assemblies bring multiple features found across numerous products into a single-product solution. This unique design results in cost and labor savings over conventional industry-standard products. The robust assemblies provide excellent EMI and RFI shielding plus sealing protection (liquids and dust).
Molex’s Impact™ Backplane Connector System provides data rates up
to and beyond 25 Gbps along with superior signal density of up to 30 pairs
per cm (80 differential pairs per inch). The broad-edge-coupled
transmission technology enables low cross talk and high signal bandwidth
while minimizing channel-performance variation across every
differential pair within the system. Impact™ 85 Ohm Plus leverages the
100 Ohm technology, density and footprint that offers an electrically
enhanced solution with the addition of a plus clip which improves common
mode performance. Impact™ Power is offered in 3- through 6-pair sizes
in conventional, coplanar and mezzanine configurations, with current
ratings from 60.0 to 120.0A per module. Designed for traditional
backplane and/or midplane architectures, the Impact™ Backplane Connector
System meets the growing demand for next-generation high-speed
Molex FAKRA II SMB connector system retains the high-performing,
cost-effective attributes as the original FAKRA connector series. The
enhanced features offered by the FAKRA II connector system demonstrate
Molex’s dedication to meet the continued mechanical and environmental
requirements of the automotive industry. The FAKRA II SMB product
offering meets both American USCAR and German FAKRA automotive
standards. Standard uses for FAKRA connectors are coaxial connections on
external antennas; such applications include SDARS, Cellular, GPS
key-less entry and satellite radio. The FAKRA connector provides a
key feature along with a visual color code to differentiate between
applications. Molex offers FAKRA connectors with a high-temperature
shroud that is fully compatible with lead-free reflow processes.
Molex's SMT FFC/FPC Connectors with Sn-Ag-Bi plating product range features miniature FFC/FPC SMT connectors designed to meet a wide variety of space and application-specific needs. The Sn-Ag-Bi plating reduces and/or prevents the production of tin whiskers to increase the reliability of the associated parts. These connectors offer compact depth, height and length measurements for applications with tight packaging requirements. The robust actuator design helps prevent damage caused by extensive
testing, cycling, or rough handling. Zero insertion force (ZIF)
and LIF options allow for repeat cycling with minimum wear. Available in a variety of fine-pitch options, Molex's Microminiature FFC/FPC lower-profile and higher-density features meet the downsizing needs of electronic equipment makers.
Molex HOZOX™ EMI Absorption Sheets and Tape achieves superior EMI noise mitigation through a unique layered design of magnetic and conductive/dielectric material. With a thickness of only 100 microns, the dual-layer structure gives a device manufacturer or electronics OEM the competitive advantage of mitigating radiated EMI noise in an ultra-broad spectrum. The magnetic layer’s powder composite absorbs lower frequency electromagnetic energy, while the conductive layer’s powder and high-loss dielectric resin absorb higher frequency electromagnetic energy. HOZOX™ may be applied to a wide variety of electronic products, including: telecommunication equipment; RF and microwave devices; consumer electronics; mobile devices; IT and medical equipment.
Now Available - Reflow Process Compatible (RPC) headers are now available in both signal and power applications and can handle solder temperatures up to 260ºC. Signal application KK 254 connectors delivers up to 5.0A and 250V per circuit in a 2.54mm centerline pitch. Power application KK 396 connectors deliver 13.0A and 600V per circuit in a 3.96mm centerline pitch.
Molex KK® Interconnection System offers many polarization features to ensure correct mating in an application. The KK® Interconnection System has offset header entry holes, which provide 180º polarization, allowing both power and signal to carry through the same housing, and can also be loaded with optional polarization keys and pegs, to help ensure that the headers and housings only mate one way. Customizable KK headers allow for more polarization options and design configurations, such as headers with voided pins, customized pin lengths, kinked PC tails, and varying tin or gold plating options, providing application design flexibility. The Molex KK® Interconnection System of "building block" connectors can create thousands of different configurations, allowing each user to build a system precisely suited for any application on centers from 2.50 to 5.08mm with a maximum current of 13.0A per circuit while handling up to 600V.
Molex Micro IDT Coaxial Connectors feature ultra-thin wires that provide superior flexibility, better shielding, easier signal routing, and greater space savings in tight packaging applications than FFC/FPC connectors. Originally designed to run signaling through the hinge area of swivel-type cell phones with rotating LCDs, Molex’s 0.40mm Micro IDT Coaxial connectors maneuver through twists and turns that FPCs cannot. The series IDT termination assembly method results in a 30% space savings versus hand-soldering, A double-clamp wire grounding method provides both electrical and mechanical grounding. This method offers a more reliable termination method than hand-soldering and up to 60% less transmission (dB) loss at frequencies between 1-3MHz. Molex’s 0.40mm Micro IDT Coaxial Connectors are well-suited for mobile phones, digital cameras/camcorders, test connectors for high speed applications, notebook computers, PDAs, Mini DVD players, MP3 players, any application with a rotating LCD.
Molex SlimStack™ ST7 0.35mm pitch Board-to-Board Connectors are
designed with a narrow 1.90mm width and short 0.70mm length to provide
maximum space savings on thin mobile applications. The ST7 0.35mm pitch
board-to-board connector system provides the most space savings of any
comparable pitch system and offers robust features that provide secure
mating retention, terminal protection and reliable electrical contact.
SlimStack ST7 ensures secure mating using a double friction lock system.
Additional features include a sharp-edge terminal design to remove flux
when locking into place, and a tactile click to confirm secure mating.
The system also includes nickel-barrier plating to avoid the risk of
Molex VITA 66.1 Ruggedized Optical MT Backplane Connector System simplifies installation and maintenance of rugged embedded VPX MIL/AERO backplane applications. The patent-pending MT ferrule-carrier design enables field servicing without the use of hand tools. The design allows the system to blind-mate backplane applications requiring optically robust interfaces with simple accessibility and streamline MT assembly installation or regular maintenance. Compliant with ANSI-ratified VITA 66.1 specification for VPX
architecture, the system's MT termini are available in 8, 12 or 24 fibers in standard multimode and singlemode or VersaBeam™ (expanded beam MT). The system supports up to two floating MT ferrules (termini) to aid in proper mating of blind-mate applications. With its robust housing with heavy-duty anodized aluminum construction, ability to withstand extreme temperature ranges, and VITA 66.1 compliant footprint, the Molex VITA 66.1 Ruggedized Optical MT Backplane Connector System is ideal for rugged military and non-automotive commercial applications.
Molex’s SpeedStack™ Mezzanine Connector System offers a high-density, low-profile solution that delivers data rates up to 40 Gbps per differential pair. Featuring mated stack heights 4.00 to 10.00mm with a 0.80mm pitch, the SpeedStack Mezzanine Connector System provides design flexibility for PCB space constrained applications. The low-profile 0.80mm pitch and narrow housing design minimize airflow obstructions and promote system cooling. The system's split-pad PCB design allows for electrical tuning performance to achieve data rates up 40 Gbps per differential pair and provides edgecard compatibility. SpeedStack's robust insert-molded wafer design with protected shrouded housing support the terminal location to improve electrical balance within the signals for low profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes cross-talk. The Molex’s SpeedStack™ Mezzanine Connector System is ideal for applications with limited PCB real estate including telecommunications, networking, military, medical, and consumer applications.