Molex, established in 1938, is one of the world's largest global manufacturers of interconnect products. Molex creates innovative product solutions for wire-to-wire, wire-to-board, and board-to-board connectors, including header, backplane, terminal, telecom, ethernet, and cable, as well as application tooling. Molex's efforts to minimize the environmental impacts of business activities, products, and services are reflected in their commitment to their environment management system, ECOCARE.
For more Molex products, visit Temp-Flex Cable, manufacturer of specialty wire & cable typically used in markets with extreme conditions and harsh environments.
For more Molex products, visit FCT Electronics, manufacturer of electrical connectors and associated products for the electronics industry.
Now Available - Reflow Process Compatible (RPC) headers are now available in both signal and power applications and can handle solder temperatures up to 260ºC. Signal application KK 254 connectors delivers up to 5.0A and 250V per circuit in a 2.54mm centerline pitch. Power application KK 396 connectors deliver 13.0A and 600V per circuit in a 3.96mm centerline pitch.
Molex KK® Interconnection System offers many polarization features to ensure correct mating in an application. The KK® Interconnection System has offset header entry holes, which provide 180º polarization, allowing both power and signal to carry through the same housing, and can also be loaded with optional polarization keys and pegs, to help ensure that the headers and housings only mate one way. Customizable KK headers allow for more polarization options and design configurations, such as headers with voided pins, customized pin lengths, kinked PC tails, and varying tin or gold plating options, providing application design flexibility. The Molex KK® Interconnection System of "building block" connectors can create thousands of different configurations, allowing each user to build a system precisely suited for any application on centers from 2.50 to 5.08mm with a maximum current of 13.0A per circuit while handling up to 600V.
Molex Micro IDT Coaxial Connectors feature ultra-thin wires that provide superior flexibility, better shielding, easier signal routing, and greater space savings in tight packaging applications than FFC/FPC connectors. Originally designed to run signaling through the hinge area of swivel-type cell phones with rotating LCDs, Molex’s 0.40mm Micro IDT Coaxial connectors maneuver through twists and turns that FPCs cannot. The series IDT termination assembly method results in a 30% space savings versus hand-soldering, A double-clamp wire grounding method provides both electrical and mechanical grounding. This method offers a more reliable termination method than hand-soldering and up to 60% less transmission (dB) loss at frequencies between 1-3MHz. Molex’s 0.40mm Micro IDT Coaxial Connectors are well-suited for mobile phones, digital cameras/camcorders, test connectors for high speed applications, notebook computers, PDAs, Mini DVD players, MP3 players, any application with a rotating LCD.
Molex SlimStack™ ST7 0.35mm pitch Board-to-Board Connectors are
designed with a narrow 1.90mm width and short 0.70mm length to provide
maximum space savings on thin mobile applications. The ST7 0.35mm pitch
board-to-board connector system provides the most space savings of any
comparable pitch system and offers robust features that provide secure
mating retention, terminal protection and reliable electrical contact.
SlimStack ST7 ensures secure mating using a double friction lock system.
Additional features include a sharp-edge terminal design to remove flux
when locking into place, and a tactile click to confirm secure mating.
The system also includes nickel-barrier plating to avoid the risk of
Molex Mega-Fit™ connectors are designed to deliver an alternative, higher-current power over existing power connectors. The patented Mega-Fit™ contact-style connector system achieves power connections up to 20A per circuit for wire-to-wire and wire-to-board configurations in virtually any industry or application. The connectors are designed with an increased package size over legacy power connectors, 5.70mm versus 4.20mm pitch, allowing for improved heat dissipation, increased creepage (the shortest path between two conductive parts) and clearance for higher-amperage applications. Mega-Fit™ products are UL recognized, CSA approved and TUV licensed. All components are lead-free and RoHS compliant.
Molex Pico-Lock™ SMT Wire-to-Board Connectors offer a unique side
positive-lock design and high current handling capacity for consumer
applications. The 1.50mm pitch, 2.00mm height Pico-Lock Connectors with
side positive-locks provide a high signal-line current capability of
3.0A. This design allows the Molex Pico-Lock SMT Wire-to-Board
Connectors to achieve ultra-low profile, robust connections in applications such as LED TVs, Notebooks and Tablet PCs. A guide rib on
the housing provides polarization along with mating guidance to ensure secure connections. Features also include friction locks for
additional mating assurance and visual mating confirmation as well as a
wide solder tab that wraps up into the header and around the housing for
additional PCB retention and mechanical system assurance.
Molex's SlimStack™ ST6 Series features the world’s smallest 0.35mm pitch board-to-board connectors. The ST6 Series provides secure mating retention, terminal protection, and reliable electrical contact through its sharp-edged, dimple-lock terminal design, metal cover nail with fitting-nail lock, and double friction lock system. The small size makes the Molex SlimStack ST6 0.35mm Pitch SMT Board-to-Board Connectors ideal for the thinnest and most compact mobile applications such as mobile phones and tablet PCs.
Molex VITA 66.1 Ruggedized Optical MT Backplane Connector System simplifies installation and maintenance of rugged embedded VPX MIL/AERO backplane applications. The patent-pending MT ferrule-carrier design enables field servicing without the use of hand tools. The design allows the system to blind-mate backplane applications requiring optically robust interfaces with simple accessibility and streamline MT assembly installation or regular maintenance. Compliant with ANSI-ratified VITA 66.1 specification for VPX
architecture, the system's MT termini are available in 8, 12 or 24 fibers in standard multimode and singlemode or VersaBeam™ (expanded beam MT). The system supports up to two floating MT ferrules (termini) to aid in proper mating of blind-mate applications. With its robust housing with heavy-duty anodized aluminum construction, ability to withstand extreme temperature ranges, and VITA 66.1 compliant footprint, the Molex VITA 66.1 Ruggedized Optical MT Backplane Connector System is ideal for rugged military and non-automotive commercial applications.
Molex’s SpeedStack™ Mezzanine Connector System offers a high-density, low-profile solution that delivers data rates up to 40 Gbps per differential pair. Featuring mated stack heights 4.00 to 10.00mm with a 0.80mm pitch, the SpeedStack Mezzanine Connector System provides design flexibility for PCB space constrained applications. The low-profile 0.80mm pitch and narrow housing design minimize airflow obstructions and promote system cooling. The system's split-pad PCB design allows for electrical tuning performance to achieve data rates up 40 Gbps per differential pair and provides edgecard compatibility. SpeedStack's robust insert-molded wafer design with protected shrouded housing support the terminal location to improve electrical balance within the signals for low profile, high-density systems. In addition, a common grounding pin improves electrical performance and minimizes cross-talk. The Molex’s SpeedStack™ Mezzanine Connector System is ideal for applications with limited PCB real estate including telecommunications, networking, military, medical, and consumer applications.
Molex's unsealed miniature Mini50™ is a single-row, wire-to-board connection system with smaller terminals to fit more low-current electrical circuits in interior, unsealed, transportation-vehicle environments. The CTX50 mating
terminal wire grip design offers the ability to reduce wire gauge sizes
while maintaining retention strength. The design achieves a 50% space
savings compared to traditional USCAR standard 0.64mm unsealed connector
systems. Orientation features are molded into the header, vertical or
right angle options provide wire-routing and module design flexibility. Molex Mini50 Unsealed Automotive Connectors
are well-suited for automotive and commercial transportation
applications including headliners, clusters / navigation, radios,
cameras / sensors, HVAC, switches, lighting, mirrors, and steering wheel