Laird Technologies / Thermal
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Laird Technologies is an industry leader in high-performance and cost-effective thermal interface materials and technology. Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance in products for applications in telecom, and instrumentation, such as thermoelectric cooling/heating modules.
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Laird Technologies / Thermal Part Search
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Resources
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Laird Technologies CP Series Thermoelectric Modules with Sealant - EXPANSION
Laird Technologies has expanded its CP Series to include Thermoelectric Modules
with Epoxy and RT sealants. The Epoxy version features a low density
syntactic foam epoxy encapsulant with a temperature range of -55⁰ to
150⁰C and the RT version has a non-corrosive, silicone adhesive sealant
with a temperature range of -60⁰ to 204⁰C.
Known as 'the standard' in the thermoelectric industry, the Laird Technologies CP Series consists of high-performance and highly reliable Thermoelectric Modules (TEMs)
available in numerous heat pumping capacities, geometric shapes,
geometric sizes, and input power ranges. Constructed using Bismuth
Telluride semiconductor material and thermally conductive aluminum oxide ceramics, the Laird Technologies CP Series Thermoelectric Modules
feature precise temperature control and reliable solid state operation.
Designed for higher current and large heat-pumping applications,the Laird Technologies CP Series TEMs
are ideally suited for applications such as medical lasers, lab science
instrumentation, clinical diagnostic systems, photonics laser systems,
electronic enclosure cooling, food & beverage cooling, and chillers
(liquid cooling). RoHS Compliant and environmentally friendly.
View the entire CP Series
Laird Technologies Direct-to-Air (DA) Thermoelectric Assembly Systems
Laird Technologies/Thermal's Direct-to-Air (DA) Thermoelectric Assembly Systems cool objects via conduction. Heat is absorbed through a cold plate, pumping the heat through the TEM (Thermoelectric Modules) and dissipating it into the air through a heat sink. Specifications apply to an ambient temperature of 32ºC and nominal voltage with tolerances ±10%. Laird's Direct-to-Air (DA) Thermoelectric Assembly Systems offer dependable, compact performance and are very environmentally friendly since they have no refrigerants or CFCs.
Laird Technologies Air-to-Air (AA) Thermoelectric Assembly Systems
Laird Technologies/Thermal's Air-to-Air (AA) Thermoelectric Assembly Systems cool objects via convection. Heat is absorbed and dissipated by heat exchangers equipped with fans. Specifications apply to ambient temperature of 32ºC and nominal voltage with tolerances ± 10%. Laird's Air-to-Air (AA) Thermoelectric Assembly Systems (TEAs) offer dependable, compact performance and are environmentally friendly since they have no refrigerants or CFCs.
Laird Thermal Interface Solutions
Laird Technologies offers Thermal Interface Solutions for today's challenges with electronics that are smaller, but more powerful. Laird's TIMs are designed to fill in air gaps and microscopic irregularities to provide more efficient cooling.
Tgard™ Electrical Insulators are thermally conductive for use where electrical isolation and thermal conductivity is critical.
Tpcm™ High-Performance
product line is ideal for applications in which reliability,
repeatability, and handling must be controlled to optimize the
performance as part of the total thermal solution.
Tgrease™ High-Performance
product is used in applications where a minimum bond line, constant
pressure, and ease of screen printing is desired for optimal
performance. Tgrease is designed to maximize reliability by eliminating
pump out inmost applications.
Tflex™ Gap Fillers are
used to bridge the interface between hot components and a chassis or
heat sink assembly. The combination of good thermal conductivity and
softness reduces mechanical stress, but maintains thermal performance.
Tlam™ and Tpreg™ Thermal Printed Circuit Boards are thermally conductive circuit boards designed with Laird's unique dielectric materials 1KA, HTD and LLD.
Tputty™ Gap Filler
is used to bridge the interface between hot components and a chassis or
heat sink assembly when elimination of mechanical stress or bulk
dispensing are critical design considerations.
Tpli™ Gap Filler is used where high thermal conductivity and low pressures are required.
Tgon™ 800 Gap Filler is a high-performance, cost-effective TIM that can be used where electrical isolation is not required.