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Laird is an industry leader in high-performance and highly efficient thermal materials and engineered thermal solutions. Laird provides the knowledge, innovation, and resources to ensure exceptional thermal performance in products for applications in telecom, medical, industrial and automotive applications.

 
Laird Technologies Newest Products

Laird Technologies/Thermal Solutions Product Line

Laird Technologies/Thermal Solutions New Products

Added 09/2012 Laird Technologies OptoTEC™ Miniature Thermoelectric Modules Learn More
Added 07/2012 Laird Technologies UltraTec™ (UT) Series Thermoelectric Modules Learn More
Added 06/2012 Laird Technologies PolarTEC™ Thermoelectric Modules Learn More
Added 06/2012 Laird Technologies Liquid-Air (LA) Assemblies Learn More
Added 06/2012 Laird Technologies ThermaTEC™ High Temperature Thermoelectric Modules Learn More
Added 07/2011 Laird Technologies CP Series Thermoelectric Modules w/ Sealant - EXPANSION Learn More
Added 10/2010 Laird Technologies Thermal Interface Solutions - New at Mouser Learn More

Laird Technologies/Thermal Solutions Featured Products

Laird Technologies OptoTEC™ Miniature Thermoelectric Modules

The OptoTEC™ Series from Laird Technologies is a Miniature Thermoelectric Module (TEM). OptoTEC TEMs are used in the the telecom and photonics industries to stabilize temperature in optical applications, such as laser diodes, IR sensors, and crystal oscillators. Multiple configurations and surface finishes are available.

Laird Technologies ThermaTEC™ Thermoelectric Modules

ThermaTEC™ Thermoelectric Modules from Laird Technologies are designed for higher current and larger heat-pumping applications where cycling conditions or high temperature exists. These TEMs are ideal for power generation or applications where both heating and cooling modes are required.

Laird Technologies PolarTEC™ Thermoelectric Modules

Laird Technologies offers the PolarTec™ Series Thermoelectric Modules, designed for higher current and larger heat-pumping applications. The porch style design provides strong lead attachment. This TEM series is available in 4, 6, and 8 amp configurations.

Laird UltraTec™ (UT) Series High Power Thermoelectric Modules

Laird Technologies UltraTec™ (UT) Series Thermoelectric Modules (TEM) are high heat pumping density TEMs. These devices are suitable for applications requiring higher current and larger heat-pumping capacity. Features of the UT Series from Laird include precise temperature control, solid state operation, and no sound or vibration.

Laird Technologies CP Series Thermoelectric Modules with Sealant - EXPANSION

Laird Technologies has expanded its CP Series to include Thermoelectric Modules with Epoxy and RT sealants. The Epoxy version features a low density syntactic foam epoxy encapsulant with a temperature range of -55⁰ to 150⁰C and the RT version has a non-corrosive, silicone adhesive sealant with a temperature range of -60⁰ to 204⁰C.

Known as 'the standard' in the thermoelectric industry, the Laird Technologies CP Series consists of high-performance and highly reliable Thermoelectric Modules (TEMs) available in numerous heat pumping capacities, geometric shapes, geometric sizes, and input power ranges. Constructed using Bismuth Telluride semiconductor material and thermally conductive aluminum oxide ceramics, the Laird Technologies CP Series Thermoelectric Modules feature precise temperature control and reliable solid state operation. Designed for higher current and large heat-pumping applications,the Laird Technologies CP Series TEMs are ideally suited for applications such as medical lasers, lab science instrumentation, clinical diagnostic systems, photonics laser systems, electronic enclosure cooling, food & beverage cooling, and chillers (liquid cooling). RoHS Compliant and environmentally friendly.
View the entire CP Series

Laird Technologies Direct-to-Air (DA) Thermoelectric Assembly Systems

Laird Technologies/Thermal's Direct-to-Air (DA) Thermoelectric Assembly Systems cool objects via conduction. Heat is absorbed through a cold plate, pumping the heat through the TEM (Thermoelectric Modules) and dissipating it into the air through a heat sink. Specifications apply to an ambient temperature of 32ºC and nominal voltage with tolerances ±10%. Laird's Direct-to-Air (DA) Thermoelectric Assembly Systems offer dependable, compact performance and are very environmentally friendly since they have no refrigerants or CFCs.

Laird Technologies Air-to-Air (AA) Thermoelectric Assembly Systems

Laird Technologies/Thermal's Air-to-Air (AA) Thermoelectric Assembly Systems cool objects via convection. Heat is absorbed and dissipated by heat exchangers equipped with fans. Specifications apply to ambient temperature of 32ºC and nominal voltage with tolerances ± 10%. Laird's Air-to-Air (AA) Thermoelectric Assembly Systems (TEAs) offer dependable, compact performance and are environmentally friendly since they have no refrigerants or CFCs.

Laird Thermal Interface Solutions

Laird Technologies offers Thermal Interface Solutions for today's challenges with electronics that are smaller, but more powerful. Laird's TIMs are designed to fill in air gaps and microscopic irregularities to provide more efficient cooling.
Tgard™ Electrical Insulators are thermally conductive for use where electrical isolation and thermal conductivity is critical.
Tpcm™ High-Performance product line is ideal for applications in which reliability, repeatability, and handling must be controlled to optimize the performance as part of the total thermal solution.
Tgrease™ High-Performance product is used in applications where a minimum bond line, constant pressure, and ease of screen printing is desired for optimal performance. Tgrease is designed to maximize reliability by eliminating pump out inmost applications.
Tflex™ Gap Fillers are used to bridge the interface between hot components and a chassis or heat sink assembly. The combination of good thermal conductivity and softness reduces mechanical stress, but maintains thermal performance.
Tlam™ and Tpreg™ Thermal Printed Circuit Boards are thermally conductive circuit boards designed with Laird's unique dielectric materials 1KA, HTD and LLD.
Tputty™ Gap Filler is used to bridge the interface between hot components and a chassis or heat sink assembly when elimination of mechanical stress or bulk dispensing are critical design considerations.
Tpli™ Gap Filler is used where high thermal conductivity and low pressures are required.
Tgon™ 800 Gap Filler is a high-performance, cost-effective TIM that can be used where electrical isolation is not required.

Laird Applications & Technologies

Laird Technologies products are on Mouser's Applications & Technologies Sites listed below. Select a category to learn about the latest applications and industry trends.
     
     
     
 
     
For additional information about Laird Technologies Applications, visit the applications section of their website.

Laird Technologies/Thermal Solutions Videos