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FI Series High Speed Cable Assembly

Development Kits

The JAE Electronics FI Series High Speed Cable Assembly Development Kits for LVDS are available in 1-row types for thin devices and 2-row types where high density packaging is required. The LCD connector side has crimped contacts per VESA specifications. The board side connector contacts are crimped onto discrete wire, allowing the customer to populate the connector housing according to their requirements. No expensive crimp tool is required for JAE's FI series High Speed Cable Assembly Development Kits, allowing low cost LVDS cable development for new designs and prototypes in the growing LCD market.

Associated Products
FI-R Series
FI-X Series
FI-S Series

Features
General Specification
1 row type suitable for thin devices, 2 rows type for high density packaging (staggered contact arrangement)
Number of contacts

1 row: 2, 3, 4, 5, 6, 8, 10, 15, 20, 25, 30
Low-profile, SMT type board-mount receptacle SMT terminals: 1 row type 1.25 mm spacing, 2 rows type 0.625 mm spacing
2 rows: 5, 7, 9, 11, 13, 15, 17, 19, 21, 26, 31, 41

For LCD interface
Receptacle with hold-down for preventing float up when soldering, and offering additional retention on board.
1 row: 20-19, 20,

2 rows: 21-20, 21, 31, 41
Key for preventing erroneous mating.
Rated current
Friction lock.
1 Amp
Receptacles can be supplied in embossed tape allowing automatic mounting
Dielectric withstanding voltage

500 VACr.m.s. (1 minute)
For interface of LCD
Insulation resistance
Board side receptacle with 2.11 mm mounting height (1 row, right angle with metallic shell type)
100 megohms min.

Contact resistance
Excellent in EMI shielding effect (version with metallic shell)
40 milliohms max.
The hold-down is incorporated with shell, enabling connection to the ground on board.
Applicable wire

Crimp type: AWG #32 to #28 (discrete wire),
Cable side plug comes in three types: discrete wire crimp type, cable harness type, and ZIF (Zero Insertion Force) type for FPC.
ZIF for FPC:

1 row: 1.25 mm pitch FPC/ 0.14 mm thickness,
ZIF configuration for FPC application. No force is directly applied when inserting FPC. Easy to operate. The shell is connected to the ground on one side of FPC when inserting it.
2 rows: 0.625 mm pitch FPC/ 0.14 mm thickness

Operating temperature range

-40 deg. C to +80 deg. C
1 row type receptacle and FPC plug come in two types: standard and reverse. Both board face mount and back mount are possible, enabling insertion of plug in the same direction (face/ back).
Tool

Tooling List

FI series
For internal connection of small devices

Board side receptacle mounting height: 1.8mm (1 row), 3.7mm (2 rows)

Crimp type cable plug for discrete wire.




Datasheet Links
FI Series
FI-R Series
FI-X Series
FI-S Series


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