Case Specifications

• Terminal Screws: #10-32
• Max Contacts Torque: 10 in-lb
• Mounting Screws: #8-32
• Max Mounting Torque: 15 in-lb
• Creepage Distance: 50mm ± 1mm (min)

Heatsink Application Note

Proper heat sinking techniques are essential to performance of a TAP resistor. Please follow these guidelines when designing a TAP system:

• Heats sink plate (base plate of the resistor) temperature must be monitored to establish proper de-rating. The best technique is to attach a thermocouple to the side of the base plate of the resistor. Temperature of plastic housing or heat sink cannot be used to establish rating of the resistor. Usage of laser thermometers should be avoided.
  
• To obtain a power rating of 1000W or 2000W, the bottom case temp must not exceed 85°C. This can only be achieved if the thermal conduction to the heatsink Rth-cs<0.025°K/W. This value can be reached by using thermal transfer compound with a heat conductivity of 1W/mK. The flatness of the cooling plate must be better than 0.05mm overall. The roughness of the surface should not exceed 6.4µm.
  
• Due to very high power density, only liquid cooled heat sinks are recommended for applications when >300W power rating is desired.
  
• A properly designed heat sink should have more than 2 cooling pipes under the surface of the TAP resistor.

Electrical Specifications

• Resistance Values: 0.25Ω to 10KΩ
  
• Resistance Tolerance: ±5% to ±10%
  
• Temperature Coefficient: ±150ppm/°C (others upon request)
  
• Maximum Working Voltage: 5,000V DC, higher voltage on request, not exceeding max.power
  
• Short Time Overload: 1,200W at 70°C for 10sec., ΔR=0.4% max.
  
• Peak Current: up to 1500 amp. depending on pulse length and frequency. Please ask for details.
  
• Electric Strength Voltage: 6kVrms, 50Hz,upto 12kVrms on special request.
  
• Single Shot Voltage: up to 12kV Normwave (1.5/50 μsec)
  
• Partial Discharge: 4KVrms, <10pC, up to 7kV on special request
  
• Insulation Resistance: 10GΩ min. at 500V
  
• Creeping Distance: 42mm min.
  
• Air Distance: 14mm min.
  
• Inductance: 80nH
  
• Capacity/Mass: 110pF
  
• Capacity/Parallel: 40pF
  
• Operation Temperature: -55°C to +150°C
  
• Max. Torque for Contacts: 2 Nm
  
• Max. Torque for Mounting: 1.8 Nm M4 screws (not included)
• Derating: 8.73W/°K (0.115°K/W)

Power Rating

800W at 85°C bottom case temp. This value is only valid by using a thermal conduction to the heatsink Rthcs< 0.025°K/W. This value can be reached by using thermal transfer compound with a heat conductivity of 1W/mK. The flatness of the cooling plate must be better than 0.05mm overall. The roughness of the surface should not exceed 6.4μm.

Electrical Specifications

• Resistance Values: 0.25Ω to 100KΩ
  
• Resistance Tolerance: ±10% Std., 5% available on request.
  
• Temperature Coefficient: ±150ppm/°C (others upon request)
  
• Maximum Working Voltage: 5,000V DC, higher voltage on request, not exceeding max. power
  
• Dielectric Strength Voltage: 6k Vrms, 50Hz, 1min standard; up to 12k Vrms available
  
• Single Shot Voltage: Up to 12KV Normwave (1.5/50 μsec)
  
• Insulation Resistance: 10GΩ min. at 500V
  
• Creeping Distance: 42mm min.
  
• Air Distance: 14mm min.
  
• Inductance: ≤80nH
  
• Capacitance/Mass: ≤110pF
  
• Capacitance/Parallel: ≤40pF Operation Temperature: -55°C to +150°C
  
• Max. Torque for Contacts: 2 Nm
  
• Max. Torque for Mounting: 1.8 Nm

Derating
8.73W/°C (0.115°C/W)

Power Rating

600W at 70°C heat sink temperature or 85°C bottom case temperature. This value is only valid by using a thermal conduction to the heat sink Rth -cs<0.025°C/W. The value can be reached by using thermal transfer compound with a heat conductivity of 1w/mk. The flatness of the cooling plate must be better than 0.05mm overall. The roughness of the surface should not exceed 6.4μm.