Littelfuse SPA Overview
|
SPA™ Lead-Free / Green Series
Designers of today's electronic devices have demanded more functionality with greater flexibility and higher levels of user interaction. These circumstances have helped in driving the development of nanometer chipsets along with a multitude of user interfaces or ports. The confluence of these two has made electronic devices more susceptible to
ESD
and required the need for a more robust solution.
ESD Standards:
MIL-STD-883, Method 3015
Historically, analog and digital designers have been required to have
ESD
protection
"on-chip" to protect the
IC
during manufacturing. The most commonly used
ESD
standard in the manufacturing environment is the MIL-STD-883, Method 3015 and it's also referred to as the Human Body Model (HBM). This model discharges a 100pF capacitor through a 1500Ω resistor into the device under test. The table below points out the four test levels as defined
in the standard.
|
HBM Level
|
Contact Discharge (kV)
|
Peak Current (A)
|
|
1
|
±0.5
|
0.33
|
|
2
|
±1
|
0.67
|
|
3
|
±2
|
1.33
|
|
4
|
±4
|
2.67
|
The maximum level required for a typical IC had been ±2kV up until2007, but today that level has been drastically reduced to ±0.5kV.Obviously, this has helped chip designers save valuable silicon areafor more functionality, but in turn, it has made the IC much moresusceptible to damage from
ESD
.
|
IEC61000-4-2
Conversely, equipment manufacturers have traditionally used an
ESD
standard defined by the IEC (International Electrotechnical Commission) for system or application level testing. This model uses a 150pF capacitor which is discharged through a 330Ω
resistor
. The table below displays the four test levels as defined in the standard.
IEC Level
|
Contact Discharge (kV)
|
Peak Current (A)
|
|
1
|
±2
|
7.5
|
|
2
|
±4
|
15
|
|
3
|
±6
|
22.5
|
|
4
|
±8
|
30
|
Most all manufacturers require that their equipment pass Level 4, or ±8kV, as a minimum, however, some are looking for increased reliability and require that their devices pass a much higher level like ±15kVor±30kV.
Conclusions:
The system level
ESD
test defined by the IEC produces a substantial increase in peakcurrent compared to the military standard. If an IC is rated for 0.5kVper the MIL-STD and the equipment manufacturer tests this same IC at8kV per the IEC specification, the chip will see nearly a 100 foldincrease in peak current (i.e. 0.33A vs. 30A)!
Ultimately, hardware or board designers must add supplementary
ESD
devices to protect these sensitive chip sets from the high level
ESD threats
seen in the field.
|
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Littelfuse TVS Diode Arrays SPA™ Sample Kits
Included are 10 samples each of the 39 TVS Diode Arrays SPA™ (Silicon Protection Arrays) devices. Provides a cost effective sampling and documentation for 16 common applications.
View TVS Diode Arrays SPA™ Kit
|
Solutions:
Littelfuse
's
TVS Diode Arrays SPA™
are an ideal choice for suppressing
ESD
as their speed and clamping levels are essential to protect today's integrated circuits unlike the previous
MLV
,
MOV
, and
polymer
technologies. The
SPA™
portfolio offers a wide range of devices to suit the majority of application needs available in the market today, and this guide will steer the designer toward the appropriate
ESD
device for the particular application they're trying to protect.
|
Littelfuse TVS Diode Arrays SPA™ Sample Kits
Included are 10 samples each of 39 TVS Diode Array SPA™ devices. Provides a cost effective sampling and documentation for 16 common applications.
View TVS Diode Array SPA™ Kit
SPA Kit Datasheet
Enhanced ESD Protection
SP050xBA
The surface mount family of arrays are designed to suppress
ESD
and other transient
overvoltage
events. The
Littelfuse
SP050xBA
arrays
are used to meet the International Electrotechnical Commision Standard (IEC 61000-4-2) for Electrostatic Discharge Requirements. The series are used to help protect sensitive digital or analog input circuits on data, signal, or control lines with voltage levels up to 5VDC.
The monolithic silicon arrays are comprised of specially designed structures for transient voltage suppression (TVS). The size and shape of these structures have been tailored for transient protection. The low capacitance and clamp voltage are ideal for high speed signal line protection.
SP1003
Zener diodes
fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These
Littelfuse
SP1003
robust
diodes
can safely absorb repetitive
ESD
strikes at ±25kV (contact discharge, IEC 61000-4-2) without performance degradation. Additionally, each
diode
can safely dissipate 7A of 8/20µs surge current (IEC61000-4-5) with very low clamping voltages.
SP1005
SP1005
TVS diode
s are the newest additions to the SPA™ portfolio and provide best-in-class ESD protection by offering the lowest dynamic resistance in the industry's smallest available footprint.
SP1005
TVS Diode Array SPA™
devices (30pF @ 0V) offer up to ±30kV ESD protection and 10A (tp=8/20µs) of surge protection with only 0.7Ω of dynamic resistance, providing best-in-class clamping performance.
See Application Guide USB1.1
See Application Guide Keypad/Push Buttons
SP050xBA Datasheet
SP1003 Datasheet
SP1005 Datasheet
Bidirectional ESD Protection
SP1002
,
SP1004
Back-to-back
zener diodes
fabricated in a proprietary silicon avalanche technology protect each I/O pin to provide a high level of protection for electronic equipment that may experience destructive electrostatic discharges (
ESD
). These
Littelfuse
SP1002
and
SP1004
robust
diodes
can safely absorb repetitive
ESD
strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. Their very low loading capacitance also makes them ideal for protecting high-speed signal pins.
SP1007
The
SP1007
Series provides best-in-class
ESD
protection by offering the lowest dynamic resistance in the industry's smallest available footprint. It can withstand up to ±8kV ESD, which protects up to the maximum level of the IEC61000-4-2 international standard. The
SP1007
is a flipchip measuring only 0.62x0.32x0.28mm.
See Application Guide Audio (Speaker/Microphone)
See Application Guide Analog Video
SP1002 Datasheet
SP1004 Datasheet
SP1007 Datasheet
Low Capacitance ESD Protection
The
Littelfuse
SP30xx
Series has
ultra-low
capacitance
rail-to-rail
diodes
with an additional
zener diode
fabricated in a proprietary silicon avalanche technology to protect electronic equipment that may experience destructive
electrostatic discharges
(ESD). The low loading capacitance makes it ideal for protecting high speed signal pins such as HDMI, DVI, USB2.0, and IEEE 1394.
SP3001
,
SP3003
The
Littelfuse
SP3001
and
SP3003
Series can safely absorb repetitive
ESD strikes
at the maximum level specified in the IEC 61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance makes it ideal for protecting high speed signal pins such as HDMI, DVI, and Ethernet.
SP3002
,
SP3004
The
Littelfuse
SP3002
and
SP3004
Series can safely absorb repetitive
ESD strikes
above the maximum level (Level 4) specified in the IEC 61000-4-2 international standard without performance degradation.
SP3010
The
Littelfuse
SP3010
Series integrates 4 channels of
ultra-low capacitance
rail-to-rail
diodes
and an additional
zener diode
to provide protection against
ESD
strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation.
SP3011
The
Littelfuse
SP3011
Series integrates 6 channels of
ultra-low capacitance
rail-to-rail
diodes
and an additional
zener diode
to provide protection for
USB 3.0 ports
against
ESD
strikes at the maximum level specified in IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The extremely low loading capacitance makes it ideal for protecting any high-speed signal pins.
SP3012
The
Littelfuse
SP3012
Series integrates 4 channels of
ultra-low capacitance
rail-to-rail
diodes
and an additional
zener diode
to provide protection against
ESD
strikes above the maximum level specified in the IEC61000-4-2 international standard (±8kV contact discharge) without performance degradation. The extremely low loading capacitance makes it ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394.
Ethernet and Lightning Protection
SP3050
The
Littelfuse
SP3050
Series integrates low capacitance rail-to-rail
diodes
with an additional
zener diode
to protect each I/O pin against
ESD
and
high surge
events. This robust device can safely absorb surge current per IEC 61000-4-5 (t
P
=8/20μs) without performance degradation and a minimum ±20kV ESD per IEC 61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins.
SP03-6
,
SP03-3.3
This new broadband protection device from
Littelfuse
provides overvoltage protection for applications such as 10/100/1000 BaseT Ethernet, T3/E3 DS3 interfaces, ADSL2+, and VDSL2+. These new
SP03-6
and
SP03-3.3
protectors combine the TVS
diode
element with a
diode
rectifier bridge to provide both longitudinal and differential protection in one package. This design innovation results in a capacitive loading characteristic that is log-linear with respect to the signal voltage across the device. This reduces intermodulation (IM) distortion caused by a typical solid-state protection solution.
SP4040
The
Littelfuse
SP4040
Series provides overvoltage protection for applications such as 10/100/1000 Base-T Ethernet and T3/E3 interfaces. This device has a low capacitance of only 5pF making it suitable for PHY side Ethernet protection and the capability to protect against both longitudinal and differential transients. Furthermore, the
SP4040
Series is rated up to 100A (t
p
=2/10μs) making it suitable for line side protection as well against lightning transients as defined by GR-1089 (intra-building), ITU, YD/T, etc.
SP406x
-
NEW!
The
Littelfuse
SP406x
Series integrates low capacitance
diodes
with an additional
zener diode
to protect each I/O pin against
ESD
and
high surge
events. The robust
SP406x
devices can safely absorb up to 20A per IEC61000-4-5 (t
P
=8/20µs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 International Standard. Their low loading capacitance also makes them ideal for protecting high speed signal pins such as
1Gb Ethernet.
SP4061
-
NEW!
The
Littelfuse
SP4061
Series integrates 4 channels of low capacitance
diodes
with an additional
zener
diode
to protect sensitive I/O pins against lightning induced surge events and
ESD. The
SP4061
Series offers a typical low capacitance of 3.5pF and a low leakage current of 1μA max. at 2.5V.
SP4062
-
NEW!
The
Littelfuse
SP4062
Series integrates 4 channels of low capacitance
diodes
with an additional
zener
diode
to protect sensitive I/O pins against lightning induced surge events and
ESD. The
SP4062
Series offers a typical low capacitance of 3.5pF and a low leakage current of 1μA max. at 3.3V.
SPLV2.8-4
The
Littelfuse
SPLV2.8-4
was designed to protect low voltage, CMOS devices from
ESD
and
lightning
induced transients. There is a compensating
diode
in series with each low voltage TVS to present a low loading capacitance to the line being protected. These robust structures can safely absorb repetitive
ESD
strikes at ±30kV (contact discharge) per IEC61000-4-2 standard and each structure can safely dissipate up to 24A (IEC61000-4-5, t
p
=8/20µs) with very low clamping voltages.
EMI Filtering with ESD Protection
SP6001
,
SP6002
The
Littelfuse
SP6001
and
SP6002
SPA
series integrates 4 and 6 EMI filters (C-R-C) into a small, low-profile UDFN package with each filter providing greater than -30dB attenuation at 1GHz. Additionally, each I/O is capable of shunting ±30kV ESD strikes (IEC61000-4-2, contact discharge) away from sensitive electronic components. The performance of this small, slim design makes it extremely suitable for mobile handsets, PDAs and notebook computers.
Orderable
Part Number
|
Package Options
|
Number of
Channels
|
Series
|
ESD Level
(Contact)
|
I/O Capacitance
@ 2.5V
|
V
RWM
|
Attenuation
|
|
576-SP6001-04UTG-1
|
μDFN-8
(1.7x1.35mm)
|
4
|
SP6001
|
±30kV
|
24pF
|
6V
|
≥ -30dB
@ 1GHz
|
|
576-SP6001-06UTG-1
|
μDFN-12
(2.5x1.35mm
|
6
|
|
576-SP6002-04UTG-1
|
μDFN-8
(1.7x1.35mm)
|
4
|
SP6002
|
±30kV
|
30pF
|
6V
|
≥ -30dB
@ 1GHz
|
|
576-SP6002-06UTG-1
|
μDFN-12
(2.5x1.35mm)
|
6
|
Application Guide LCD and Camera Interfaces (Mobile)
SP6001 Datasheet
SP6002 Datasheet