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Yamaichi Test & Burn-in Sockets

Yamaichi offers the industry's most comprehensive range of Test & Burn-in Sockets. Developed using Yamaichi Electronics' Compression Mount Technology (CMT), the CMT Series Test & Burn-in Sockets meet the challenging design specifications for high-power burn-in socketing applications. The series features contact pin tips that can be configured to LGA or BGA applications and a modular design for easy replacement of socket components in the field. CMT Series Test & Burn-in Sockets provide excellent electrical performance with a stable contact resistance and low inductance for a minimum of 10,000 insertions in an operating temperature range of -55°C to +170°C. Several package options are available including PLCC (Plastic Lead Chip Carrier), SOP (Small Outline Package), and QFP (Quad Flat Package). The SOP and QFP packages have a pitch range of 0.4mm to 0.5mm and 0.4mm to 1.27mm respectively. The PLCC and SOP packages are available in clamshell and open top variations. Additional features such as two-point contact construction for high reliability and "one touch" auto-eject for easy IC removal are also available depending on the socket package.

Specifications
  • Contact Resistance: 30mΩmax. at 10mA/20mV max.
  • Mating Cycles: 10,000 insertions min.
  • Operating Temperature Range
    • High temperature range: -40°C to +170°C
    • Low temperature range: -55°C to +170°C
  • Compliant to the RoHS directive (2002/95/EC)

Applications
  • Industrial
  • Medical
  • Consumer Electronics



Yamaichi Test & Burn-in Sockets

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PLCC

The Yamaichi Test & Burn-in Sockets in the PLCC packages fit 2- or 4-sided J-Lead (Gullwing-Lead) devices and are available in open top and clamshell designs. PLCC packages feature molded slots designed for outstanding durability with low insertion / withdrawal forces.

Specifications
  • Insulation Resistance: 1,000MΩmin. at 500V DC
  • Dielectric Withstanding Voltage: 700V AC for 1 minute
  • Current Rating: 1A max.
  • Operating Temperature Range: -40°C to +170°C
Materials and Finish
  • Housing: Upper body - Polyphenylenesulfide (PPS)
  • Lower body - Polyetherimide (PEI), glass-filled
  • Contacts: Beryllium Copper (BeCu)
  • Plating: Gold over Nickel

Yamaichi PLCC Socket - Open Top
Yamaichi PLCC Socket - Open Top

Clamshell Socket
PLCC Socket - Clamshell

Part Number Pitch
Pin Count
IC Variation IC Orientation
Socket Dimensions
A
B
C (Open)
D (Closed)
IC120-0284-508 1.27mm 28 Open Top Live Bug 23.0 23.0 19.3 N/A
IC120-0324-109 1.27mm 32 Open Top Live Bug 22.5 25.0 19.3 N/A
IC120-0324-309 1.27mm 32 Open Top Live Bug 22.5 25.0 19.3 N/A
IC120-0444-306 1.27mm 44 Open Top Live Bug 28.0 28.0 19.3 N/A
IC51-0162-1035 1.27mm 16 Clamshell N/A 4.0 5.4 6.0 18.5
IC51-0324-453 1.27mm 32 Clamshell N/A 35.0 30.0 9.0 19.5
IC51-0444-400 1.27mm 44 Clamshell N/A 40.0 34.0 10.0 20.0
IC51-0484-806 0.5mm 48 Clamshell N/A 9.0 9.0 7.0 7.0
IC51-0644-807 0.5mm 64 Clamshell N/A 12.0 12.0 10.0 10.0
IC51-1004-809 0.5mm 100 Clamshell N/A 16.0 16.0 14.0 14.0

The open top design allows for unrestricted air flow and is available in live-bug & dead-bug IC orientation.

Live and Dead Bug Orientation


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SOP


The Yamaichi Test & Burn-in Sockets in the SOP packages fit 2-sided Gullwing-Lead devices from 0.4mm up to 1.27mm pitch and are available in open top and clamshell designs.

Specifications

  • Insulation Resistance:
    • 1,000MΩmin. at 100V DC, pitch 0.4, 0.5
    • 1,000MΩmin. at 500V DC, pitch 0.65, 0.8,1.27
  • Dielectric Withstanding Voltage:
    • 100V AC for 1 minute, pitch 0.4, 0.5
    • 500V AC for 1 minute, pitch 0.65
    • 700V AC for 1 minute, pitch 0.8, 1.27
  • Current Rating: 1A max.
  • Contact Force: 20g to 80g per pin
  • Operating Temperature Range: -40°C to +150°C

Materials and Finish
  • Housing: Polysulphone (PSF), glass-filled, Polyethersulphone (PES), glass-filled, Polyetherimide (PEI), glass-filled
  • Contacts: Beryllium Copper (BeCu)
  • Plating: Gold over Nickel
Yamaichi Test & Burn-in Sockets SOP Package

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Part Number Pitch Design Type Pin Count Body A Lid Size IC & Socket B (max.) Tip-to-Tip C Socket Dimensions D x E
IC189-0162-019 1.27mm Open Top 16 5.6 - 7.7 20.8 x 16.0
IC191-0482-004 0.5mm Open Top 48 18.4 - 20.0 40.0 x 20.0
IC191-0562-003 0.5mm Open Top 56 18.4 - 20.0 21.5 x 40.0

Yamaichi Test & Burn-in Sockets SOP Packages


QFP

The Yamaichi Test & Burn-in Sockets in the QFP packages fit 4-sided Gullwing-Lead devices and are available in open top and clamshell designs.

Specifications
  • Insulation Resistance:
    • 1,000MΩmin. at 100V DC
    • 1,000MΩmin. at 500V DC
  • Dielectric Withstanding Voltage: 100/500/700V AC for 1 minute
  • Contact Resistance: 30mΩmax. at 10mA/20mV max.
  • Contact Force: 20g to 80g per pin
  • Operating Temperature Range: -40°C to +170°C and -40°C to +150°C
Materials and Finish
  • Housing: Polysulphone (PSF), glass-filled, Polyethersulphone (PES), glass-filled, Polyetherimide (PEI), glass-filled
  • Contacts: Beryllium Copper (BeCu)
  • Plating: Gold over Nickel
Yamaichi Test & Burn-in QFP Sockets

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Part Number Pitch Design Type Pin Count Body A x B Tip-to-Tip C x D Parallel Clamp E 1/2 - IC Height F Socket Dimensions G x H
IC201-0644-003 0.5mm Open Top 64 10.0 x 10.0 12.0 x 12.0 - 0.7 30.0 x 36.0
IC201-1004-008 0.5mm Open Top 100 14.0 x 14.0 16.0 x 16.0 - 0.6 31.0 x 31.0
IC201-1444-026N-2 0.5mm Open Top 144 20.0 x 20.0 22.0 x 22.0 0.685 0.18 37.0 x 37.0
IC234-0484-039N 0.5mm Open Top 48 7.0 x 7.0 9.0 x 9.0 0.7365 0.127 26.6 x 26.6

Yamaiachi QFP Dimensions Outline


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