TE Connectivity offers the IMPACT™ Connector System
to meet the increased speed and density requirements for future system
upgrades and next generation data networking and telecommunications
equipment. The IMPACT™ High Density Backplane Connector System provides design engineers with a high-performance backplane solution that provides long-term reliability and reduces cost. The IMPACT High Density Backplane Connector System features a unique broad-edge- coupled design with low impedance and a localized ground return path in an optimized differential-pair array. The differential pairs are tightly coupled and surrounded by grounding structures to isolate the pairs, which minimizes crosstalk, improves overall bandwidth performance, and minimizes performance variance.
The IMPACT High Density Backplane Connector System's mating interface provides in-line, staggered, bifurcated (forked) contacts with 2 points of contact. The second is staggered 1 mm behind the first for maximum reliability and built-in, ground-signal sequencing. This acts to reduce the mating force per connector to improve the performance of the entire system. Description
| Pairs / Inch
| Header Width
| 10 Column
Diff Pair
| 16 Column
Diff Pairs
| 6 pair Impact Connector
| 80 | 28.85mm | 60 | 96 | | 5 pair Impact Connector | 67 | 24.8mm
| 50 | 80 | | 4 pair Impact Connector | 54 | 20.75mm | 40 | 64 | | 3 pair Impact Connector | 40 | 16.75mm | 30 | 48 |
The IMPACT connector offers two different plated through hole options of 0.39mm and 0.46mm for different performance options. |