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Hirose High Speed Board to Board Connectors
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Hirose High Speed Board to Board Connectors Overview
Hirose Electric Co., Ltd., a specialist in the design and manufacture of the latest electronic connectors, produces a variety of High Speed Board to Board Connectors for mezzanine applications, coplanar or vertical, with optional ground plates, and a wide range of positions and stacking heights. 
Product Matrix
| Product Family | Connector Description | No. of Positions | Current Rating(Amps)(Max.) | Stack Height (mm) | Contact Mating Area Plating | Terminal Pitch (mm) |
| IT3 | Mezzanine Connector
| 100, 200, 300 | 0.5A
| 17, 20, 22, 25, 26, 28, 30, 32, 38, 40 | Gold | BGA
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| FX10 | Two-piece connector with ground | 80, 96, 100, 120, 140, 144, 168 | 0.3 | 4, 5 | Gold | 0.5 |
| FX11 | Two-piece connector with ground | 60, 68, 80, 92, 100, 116, 120, 140 | 0.3 | 2, 2.5, 3 | Gold | 0.5 |
| FX18 | Coplaner and Vertical two piece connector with ground | 40, 60, 80, 100, 120, 140 | 0.5 | 2 (Mating length) | Gold | 0.8 |
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Hirose IT3 Series High-Speed BGA Mezz Connectors
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 The IT3 Series connector system is Hirose's newest offering for applications in the High-speed, mezzanine field. The Hirose IT3 can handle today's data rates of PCI-X and XAUI and tomorrow's 10+ Gbps requirements. Its has the versitility to transmit differential, single ended and power in one package. Stacking heights are available fron 15-40mm.
The IT3 system is composed of three, basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB and different height interposer assemblies are selected to achieve the needed height between the PCB's.
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High Density and Unmatched Reliability
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IT3's unique 3 piece design and construction gives industry leading BGA reliability, while still providing the density of 73 differential pairs per linear inch.
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Excellent SI Performance
| The high performance IT3 was designed through exhustive and detailed simulation. Data from measurement correlations support current applications needing 6.25+ Gbps, and future applications of 20+ Gbps. Click image to enlarge
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| Hirose FX11 Series B2B Connectors |
The Hirose FX11 Series B2B Connectors are 0.5mm pitch headers and receptacles with optional ground plates on both sides of the header and receptacle to improve transmission characteristics. Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. The FX11 is structured to prevent solder wicking via a solder gap in the contact SMT portion. With a stacking height of either 2mm, 2.5mm, or 3mm, the FX11 series comes in 60, 80, 100, or 120 contact positions, provides additional solder weld strength through metal fittings. Hirose's FX11 Series B2B Connectors without the grounding plate have been filled with additional signal contacts (in the 2mm height - 68, 92, 116, and 140 contact positions). These board-to-board connectors feature a rated current of 0.3A and a rated voltage of 50VAC. Ideal for notebook computers, PDA, and other miniature electronic equipment.
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Hirose FX11 Series B2B Connector Features
Hirose FX11 Series Advantage
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- The transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle.
- Signal and ground are arranged in a ratio of 10:1 to stabilize the ground.
- Reinforced fittings that make a firm connection to the ground also provide greater adhesion to the board, protecting against peeling.
- Low-profile connectors, yet a solder gap has been designed into the contact SMT portion to prevent solder from migrating.
- The secured mating length of the contact block is 0.55mm for the 2mm B to B type, and 1mm for the 2.5 or 3mm B to B type to ensure high contact reliability.
Click to enlarge
| Hirose FX11 Series B2B Connector Applications
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- Notebook PCs
- Portable terminals (PDA)
- Portable electronic equipment
| Characteristic | Specifications |
| No. of Positions | 60, 68, 80, 92, 100, 116, 120, 140 |
| Current Rating(Amps)(Max.) | 0.3 |
| PCB Mount Type | SMT |
| Contact Mating Area Plating | Gold |
| Terminal Pitch (mm) | 0.5 |
| Contact Spacing (mm) | 0.5 |
| Stack Height (mm) | 2, 2.5, 3 |
| Operating Temperature Range (degrees C) | -55 to 85 |
| Connector Type | Board mounting |
| Contact Gender | Female, Male |
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| Hirose FX18 Series B2B Connectors |
 The Hirose Electric FX18 Series Hi-Speed B2B Connectors are headers and receptacles, right angle or straight, with a 0.8mm pitch for coplanar or vertical connection. The FX18 features high-speed transmission capability up to 10Gbps and multi-functional (MF) contact (ground contact, power supply contacts up to 12A, and 3-step sequential contacts). With a large mating guide for smooth insertion, the Hirose Electric FX18 Series Hi-Speed B2B Connectors mate with a signal contact of 2.0mm and offer a voltage rating of AC100V. Contacts and MF contacts are phosphor bronze with gold-plated contact area and mounting area and nickel-plated under plating.
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Hirose FX18 Series B2B Connectors Mechanical Features
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- 0.8mm Pitch
- Variations :Coplanar / Vertical
- Number of Contacts : 40 / 60 / 80 / 100 / 120 / 140
- Multi functional contact (MF contact) as;
- ground contact to enhance grounding.
- power supply contacts up to 12 A to reduce required pin counts.
- 3-step sequential contacts for grounding and detection.
- Effective mating length of signal contact: 2.0 mm.
- (MF contact A:2.5mm / MF contact B:1.5mm)
- Pin through hole mounting MF contacts increase strength against wrenching.
- Large mating guide for easy mating.
| Hirose FX18 Series B2B Connectors Signal Integrity Features
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- Insertion Loss-to-Crosstalk-Ratio (ICR)
- The insertion loss-to-crosstalk ratio (ICR) with five-aggressor differential FEXT meets the extrapolated IEEE802.3ap specification for 10+Gbps with plenty of margins.
- Differential Impedance
- The differential impedance is within 100±10 ohms at 35 ps rise time( 20% to 80%)
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