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DM3 Series MicroSD™ Card Connectors
The smallest
connectors
on the market for mobile phone
terminations
, digital cameras, PDAs, miniature information terminals, and any other
portable
device requiring the use of small size, high reliability
microSD memory card connectors
.
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The
Hirose Electric DM3 Series MicroSD
™
Card Connectors
have extremely small external dimensions and the above-the-board height makes the
connectors
the smallest on the market. With three different card insertion/ejection types, all
card connector
s feature a unique
card slot
design that protects the
connector
s
from damage due to a mis-insertion.
Hirose Electric
designed the
MicroSD Card Connectors
with high-strength materials to produce a strong, rigid structure with 4-contact points to the PCB to ensure a secure connection of the ground circuit and to provide
EMI
protection. Ideal for mobile phone terminals, digital cameras, PDAs, miniature information terminals, and any other portable device requiring the use of small-size high-reliability
microSD memory card
connectors
.
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View Products List
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Hirose Electric DM3 Series MicroSD™ Card Connectors
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798-DM3AT-SF-PEJ
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798-DM3BT-DSF-PEJS
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798-DM3C-SF
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798-DM3D-SF
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Push-Push, with ejection mechanism, top board mounting (standard)
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Push-Push, with ejection mechanism, bottom board mounting (reverse)
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Hinge, Push-Pull, manual, without ejection mechanism, top board mounting (standard)
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Push-Pull, manual, without ejection mechanism, top board mounting (standard)
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Card fall-out prevention
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Built-in card tray and the unique push insertion-push ejection mechanism (patent pending) prevent accidental card ejection or fall-out.
Exposed termination leads
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Easy inspection and rework of the solder termination joints.
Materials, Finishes
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Insulator: LCP, black, UL94V-0
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Contacts: copper alloy, gold-plated contact area & lead area
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Guide cover: stainless steel, gold-plated lead area
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Other components: stainless steel, piano wire, nickel-plated
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Card fall-out prevention
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Built-in card tray and the unique push insertion-push ejection mechanism (patent pending) prevent accidental card ejection or fall-out.
Exposed termination leads
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Easy inspection and rework of the solder termination joints.
Materials, Finishes
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Insulator: LCP, black, UL94V-0
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Contacts: copper alloy, gold-plated contact area & lead area
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Guide cover: copper alloy, gold-plated lead area
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Other components: stainless steel, piano wire, nickel-plated
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Simple, reliable card insertion
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Hinged metal cover provides location and guides the card during the insertion/removal. Closing of the cover confirms the electrical and mechanical connection with a tactile click sensation.
Reliable contact with the card contact pads
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Unique contact design and card slide action will clean the contact areas of the card.
Materials, Finishes
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Insulator: LCP, black, UL94V-0
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Contacts: copper alloy, gold-plated contact area & lead area
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Guide cover: stainless steel, tin plated
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Partial card insertion hold
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Card will not fall-out even when it is not fully inserted. Full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel.
Accessible termination areas
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An inner lead system that can be reworked is used in this design. Contact solder terminations may be inspected and reworked.
Materials, Finishes
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Insulator: LCP, black, UL94V-0
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Contacts: copper alloy, gold-plated contact area & lead area
-
Guide cover: stainless steel, tin plated
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Ratings
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Current rating: 0.5A
Voltage rating: 125VAC
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Operating Temp. Range: -25ºC to +85C (Note 1), Storage Temp. Range: -40ºC to +85ºC (Note 2)
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Operating humidity range: RH 95%max. (No condensation)
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Item
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Specification
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Conditions
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1. Insulation resistance
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1000 MΩ min. (initial value)
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Measure at 500V DC
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2. Withstanding voltage
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No flashover or insulation breakdown
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500V AC / 1 minute
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3. Contact resistance
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100mΩ max. (initial value)
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1mA
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4. Vibration
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No electrical discontinuity of 100ns or longer
No damage, cracks, or parts dislocation
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Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,3 directions for 2 hours
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5. Humidity
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Contact resistance: 40 mΩ max. (change from initial value), Insulation resistance: 100MΩ min., No damage, cracks or parts dislocation
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96 hours at 40±2ºC, and humidity of 90 to 95%
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6. Temperature cycle
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Contact resistance: 40mΩ max. (change from initial value), Insulation resistance: 100MΩ min., No damage, cracks or parts dislocation
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-55ºC -> 5 to 35ºC -> 85ºC -> 5 to 35ºC, Times: 30 min. -> 5 min. -> 30 min. -> 5 min., 5 cycles
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7. Durability
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Contact resistance: 40 mΩ max. (change from initial value)
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10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B), 5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D)
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8. Resistance to
soldering heat
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No deformation of components affecting performance
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Reflow: At the recommended temperature profile, Manual soldering: 350ºC for 3 seconds
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Note 1. Includes temperature rise caued by current flow.
Note 2: The term "storage" refers to products stored for a long period prior to mounting and use.
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