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LS Research TiWi-R2 Integrated Transceiver Module

LS Research TiWi-R2
Integrated Transceiver Module

LS Research TiWi-R2 Integrated Transceiver Module is a high performance 2.4 GHz IEEE 802.11 b/g/n Bluetooth 2.1+EDR radio in a cost effective, pre-certified footprint. LS Research TiWi-R2 Integrated Transceiver Module has the necessary PHY/MAC layers to support WLAN applications along with a host processor over a SDIO interface. The module also provides a Bluetooth platform through the HCI transport layer. Both WLAN and Bluetooth share the same antenna port.

Features
  • IEEE 802.11 b,g,n,d,e,i, compliant
  • Bluetooth 2.1+EDR, Power Class 1.5
  • U.FL connector for external antenna
  • Terminal for PCB/Chip antenna feeds
  • Integrated band-pass filter
  • Worldwide acceptance: FCC (USA), IC (Canada), and ETSI (Europe)
  • Compact design based on Texas Instruments WL1271WSP Transceiver
  • Seamless integration with TI OMAP™ application processor
  • SDIO Host data path interfaces
  • Bluetooth Advanced Audio Interfaces
  • Low power operation mode
  • RoHS compliant
  • Streamlined development with LSR design services
Specifications
  • Typical WLAN transmit power:
    • 20.0dBm, 11Mbps, CCK (b)
    • 14.5dBm, 54Mbps, OFDM (g)
    • 12.5dBm, 65Mbps, OFDM (n)
  • Typical WLAN sensitivity:
    • -89dBm, 8% PER, 11Mbps
    • -76dBm, 10% PER, 54Mbps
    • -73dBm, 10% PER, 65Mbps
  • Miniature footprint: 18mm x 13mm
  • Low height profile: 1.9mm
Applications
  • Security
  • HVAC control, smart energy
  • Sensor networks
  • Medical
TiWi-R2 Module Block Diagram - Top-Level

TiWi-R2 Module Block Diagram - Top-Level

Module Mechanical Dimensions (maximum module height = 1.9mm)

Module Mechanical Dimensions (maximum module height = 1.9mm)

TiWi-R2 Footprint

TiWi-R2 Footprint

TiWi-R2 Pinout

TiWi-R2 Pinout
  • LS Research
  • Medical|Sensing|Wireless
  • Embedded Solutions