View Products List
|
| Littelfuse offers the SP3010 TVS Diode Array SPA™ (Silicon Protection Array) Family of Products for ESD protection, which is part of Littlefuse's Lead-free Green Series. The SP3010 integrates 4 channels of ultra-low capacitance rail-to-rail diodes and an additional zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). This robust device can safely absorb repetitive ESD strikes at the maximum level specified in the IEC61000-4-2 international standard (Level 4, ±8kV contact discharge) without performance degradation. The Littelfuse SSP3010 TVS Diode Array SPA™ products feature extremely low loading capacitance that make the SP3010 ideal for protecting high speed signal pins such as HDMI, USB3.0, USB2.0, and IEEE 1394. |
What are Silicon Protection Arrays (SPA)?
Designers of today's electronic devices have demanded more functionality with greater flexibility and higher levels of user interaction. These circumstances have helped in driving the development of nanometer chipsets along with a multitude of user interfaces or ports. The confluence of these two has made electronic devices more susceptible to ESD and required the need for a more robust solution.
The system level ESD test defined by the IEC produces a substantial increase in peak current compared to the military standard. If an IC is rated for 0.5kV per the MILSTD and the equipment manufacturer tests this same IC at 8kV per the IEC specification, the chip will see nearly a 100 fold increase in peak current (i.e. 0.33A vs. 30A)!
Ultimately, hardware or board designers must add supplementary ESD devices to protect these sensitive chipsets from the high level ESD threats seen in the field.
Littelfuse's TVS Diode Silicon Protection Arrays (SPA) are an ideal choice for suppressing ESD as their speed and clamping levels are essential to protect today's integrated circuits unlike the previous MLV, MOV, and polymer technologies. The SPATM portfolio offers a wide range of devices to suit the majority of application needs available in the market today.
|
| | SP3010 Pinout |
| SP3010 Features
| 
Pins 6, 7, 9, 10 are not internally connected but should be connected to the trace.
|
| - ESD, IEC61000-4-2, ±8kV contact, ±15kV air
- EFT, IEC61000-4-4, 40A (5/50ns)
- Lightning, IEC61000-4-5, 3A (tp=8/20µs)
- Low capacitance of 0.45pF (TYP) per I/O
- Low leakage current of 0.1µA (TYP) at 5V
- Small form factor uDFN package saves board space
| Functional Block Diagram
|
| Applications
|  |
| - LCD/PDP TVs
- DVD Players
- Desktops
- MP3 / PMP
- Set Top Boxes
- Mobile Phones
- Notebooks
- Digital Cameras
| - LUSB1.1/2.0/3.0
- HDMI
- DVI
- 10/100/1000 Ethernet
- eSATA
- 1394a/b
- LVDS
- Audio (Speaker/Microphone)
- Analog Video
- SIM Sockets
- Keypad/Push button
- LCD/Camera display interfaces
|
Absolute Maximum Ratings
| | Symbol | Parameter | Value | Units | IPP
| Peak Current (tp=8/20µs)
| 3.0 | A | | TOP | Operating Temperature
| -40 to 85
| ºC | | TSTOR | Storage Temperature
| -60 to 150
| ºC |
Electrical Characteristics (Top=25ºC)
| | Parameter | Symbol | Test Conditions
| Min | Typ | Max | Units | Reverse Standoff Voltage
| VRWN | IR≤1µA |
|
| 6.0 | V | Reverse Leakage Current
| ILEAK | VR=5V, Any I/O to GND
|
| 0.1 | 0.5 | µA |
Clamp Voltage1
|
VC | IPP=1A, TP=8/20µs, Fwd
|
| 10.8 |
| V | | IPP=2A, TP=8/20µs, Fwd |
| 12.3 |
| V |
ESD Withstand Voltage1
|
VESD | IEC61000-4-2 (Contact)
| ±8 |
|
| kV | IEC61000-4-2 (Air)
| ±15 |
|
| kV | Diode Capacitance1
| CI/O-GND | Reverse Bias=0V
|
| 0.45 |
| pF |
1 Parameter is guaranteed by design and/or device characterization
|