Bergquist Thermal Clad® Power LED IMS Substrates
Replaces conventional FR4 PCBs with better thermal management.

Bergquist Gap Pad® VO Ultimate Gap Filling Material
Ultra conformable, allows excellent interfacing and wet-out characteristics.

Bergquist Gap Pad® VO Ultra Soft Gap Filling Material
Ultra conformable, with thermal conductivity of 1.0W/m-K.

Bergquist Gap Pad® 3000S30 Gap Filling Material
Highly conformable, 3.0W/m-K conductivity for low-stress applications.

Bergquist Gap Pad® 2500S20 Gap Filling Material
Highly conformable with thermal conductivity rating of 2.4W/m-K.