Gore
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Gore provides EMI shielding solutions designed for the high-volume, wireless/convergence industry. Gore also provides applications engineering support, rapid prototyping, EMI Modeling and test capabilities, and a range of automated installation options.
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Gore Grounding Pads GS8000
Gore Grounding Pads GS8000 are soft and highly conductive foam dots with adhesive backing for applications where conformability, high conductivity, and low compressive forces are required. The Gore Grounding Pads GS8000 feature low DC resistance, excellent reliability through Accelerated Life Testing, excellent gap tolerance take-up, and compensates for materials with large tolerances.
Gore GORE-SHIELD® Sample and Prototype Kits
The Gore GORE-SHIELD® SMT EMI Gaskets and Grounding Pads Sample Kit contains electrically conductive, low cost solutions. The SMT gasket consists of a solderable metal layer bonded to GS5200 gasket material and provides reliable contact points. The SMT grounding pad is highly compressible and resilient in a standard EIA 481 tape-and-reel format.
The Gore GORE-SHIELD® EMI Prototype Kit contains gasket materials that are designed for demanding commercial applications and provide up to 90dB of shielding effectiveness. The gasket materials are provided with an integral pressure-sensitive conductive adhesive.
Gore Supersoft SMT EMI Gaskets and Grounding Pads
The Supersoft SMT EMI Gaskets and grounding pads from Gore
are highly compressible, resilient, and very compatible with SMT
installation processes. The product is manufactured with a conductive,
silver-coated, and hollow silicone extruded material that is bonded to
a solderable silver-plated metal support layer. No curing is required
and the material is easily repairable, allowing the gaskets and
grounding pads to survive multiple solder-reflow operations.
