congatec is an experienced leader in designing and manufacturing embedded computer modules. congatec's products feature highly reliable and cutting-edge technologies, including the Intel® Pentium® M processor line and a versatile and flexible BIOS. The company also provides leading display technology, including embedded flat panel interface.
congatec is part of The Intel® Internet of Things Solutions Alliance, one of the world's most recognized and trusted technology ecosystems. Members of The Intel® Internet of Things Solutions Alliance include leading solution and service providers from a broad range of industries, who provide the hardware, software, firmware, tools, and systems integration that developers need to take a leading role in the rise of intelligent systems.
Congatec's conga-QMX6 Computer-On-Modules are embedded computer modules that provide complete Qseven support for easy integration of Freescale Semiconductor i.MX 6 series processors into ARM-based designs. In addition congatec offers a Qseven Starter Kit, expanded software support with Adeneo for Windows Embedded Compact 7 (WEC7), Linux board support package (BSP) plus a congatec tablet PC demonstrator. The main component of the design-in support is the conga-QMX6 Qseven COM. It comes equipped with the Freescale i.MX 6 series processor family based on ARM Cortex-A9 architecture which is scalable from 1 (i.MX 6Solo) to 4 (i.MX 6Quad) ARM cores and sports a sophisticated high-end, 3D-ready HD graphics interface. Commercial versions are running on a frequency of 1.0 GHz while industrial variants run at 800MHz. The conga-QMX6 module supports an embedded Linux version, Android and Microsoft Windows Embedded Compact 7. WEC7 provides a 32-bit hard real-time operating system with Silverlight support, a customizable user interface, a new multimedia player, Internet Explorer with Flash 10.1 and a powerful development tool. In addition, it provides customized development and design tools for programmers; XAML and C++ can be used. To rapidly prototype embedded systems for ARM designs and to minimize the development costs, congatec also provides a complete Starter Kit comprising the conga-QMX6 module, the flexible Qseven evaluation carrier board conga-QEVAL and a matching 12V power adapter. With the supplied cable set, it takes just minutes to build a compact demo system. The conga-QEVAL is easy to integrate and offers multiple interfaces.
congatec COM Express® conga-BAF Modules offer outstanding graphics performance with low power consumption. They are based on the AMD Embedded G-Series Processors and feature extreme graphics performance with DirectX®11 graphics. congatec COM Express® conga-BAF Modules also provide flexible task allocation on the CPU and GPU and an excellent performance-per-watt ratio.
congatec Qseven™ conga-QA6 Industrial Temperature Modules are a series of ultra mobile modules offering improved graphics performance and an extended temperature range. They are each equipped with the Intel Atom™ Processor E6xx Series and the Intel EG20 Platform Controller Hub chipset. congatec Qseven™ conga-QA6 Industrial Temperature Modules feature an integrated Intel 3D Graphics Core with 50% performance enhancement, 2x fast serial differential interfaces for high data bandwidth, and a CAN Bus interface. These modules are designed specifically for the extended industrial temperature range of -40°C to +85°C.
congatec conga-QA Qseven™ Computer-On-Modules are unlike previous Computer-On-Modules (COM) standards due to their primary focus being directed towards mobile and ultra mobile applications. congatec conga-QA Qseven™ Computer-On-Modules define fast serial differential interfaces such as PCI Express and Serial ATA but omit support for legacy interfaces like EIDE and PCI in order to provide ideal support for today as well as future CPUs and chipsets. Fanless and ultra mobile applications are easily implemented, thanks to the extremely low power consumption of the Intel® Atom™ processor Z5xx series and the Intel® System Controller Hub US15W. The modules' dimensions are only 70x70mm², meaning they can be easily integrated into size-constricted systems. Qseven™ is the first COM standard that defines an integrative software interface. This Application Programming Interface (API) covers these important embedded features: Watchdog Timer, I²C Bus, LCD brightness control, BIOS user memory, and system temperature. Qseven™ modules from different manufacturers can thus be easily exchanged without modifications to hardware or software.
The congatec conga-CA COM Express™ Computer-On-Module features an Intel Atom™ Z5xx series processor with an Intel System Controller Hub US15W in a compact 95x95mm size form factor. This conga-CA COM Express Computer-On-Module is equipped with the congatec embedded BIOS, which includes a board controller that enhances embedded features such as system monitoring, watchdog timer, and the I²C bus. The congatec conga-CA COM Express Computer-On-Module also provides extremely low power consumption, flat panel detection, and ACPI 3.0 with battery support.
congatec´s conga-B945 COM Express Modules offer high performance through the latest Intel® Core™ 2 Duo 2x2.16 GHz processor with 4 MByte shared L2 cache and a rich feature set that includes 5x1 PCI Express and 1x16 PCI Express Graphic lanes. The modules feature Gigabit Ethernet via the COM Express connectors, high definition audio codecs, and 3D, 2D and video graphics efficiency, as well as an Embedded BIOS that supports ACPI battery support, Multistage Watchdog, and Fast Mode I2C Bus.
congatec´s conga-CKIT for COM Express™ complete quick-start-kit lets designers test all the available features of the PICMG-defined COM Express for quick and efficient design of embedded applications. The single-case kits include a conga-CEVAL evaluation carrier board, a conga-Cdebug debug card with cables, a conga-FPA1 flat panel adapter with cables, an HDA adapter card, 128 MByte USB memory stick and more. congatec software tools and quick installation guide are available on the congatec website.
congatec´s conga-X945/L7400 embedded CPU module features a Dual Core XTX™ module with Intel 945GM chipset and Intel Core2Duo L7400. The X945
provides high connectivity, high-end 3D, 2D and video graphics
capabilities, as well as utilization of high definition audio codecs
for easy implementation of telecommunications and audio applications
requiring high sound quality and numerous channels. The product
includes an LV-CPU with 1.5 GHz , 2 MB L2-Cache, and 667 MHz FSB.