Berguist Gap Pad® VO Ultra Soft Gap Filling Material

Gap Pad® VO Ultra Soft from Bergquist is ultra conformable gel-like Gap Filling Material with thermal conductivity of 1.0 W/m-K. For applications requiring a minimum amount of pressure on components, the material gives excellent low-stress vibration dampening and shock absorbency. Bergquist Gap Pad® VO Ultra Soft Gap Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.

Features

Thermal conductivity: 1.0 W/m-K
Highly conformable, low hardness
"Gel-like" modulus
Designed for low-stress applications
Puncture, shear and tear resistant
Electrically isolating

Applications

Telecommunications
Computer and peripherals
Power conversion
Between heat-generating semiconductors or magnetic components and a heat sink
Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader