Bergquist's guiding principles are innovation, performance and customer satisfaction. Today, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad® thermally conductive interface materials, Gap Pad® electrically insulating and non-insulating gap fillers, Hi-Flow® phase change grease replacement materials, Bond-Ply™ thermally conductive adhesive tapes, and Thermal Clad® insulated metal substrates.
Bergquist's Sil-Pad A2000 High Performance High Reliability Insulator is a conformable elastomer with very high thermal conductivity that acts as a thermal interface between electrical components and heat sinks. Sil-Pad A2000 is for applications where optimal heat transfer is a requirement. This thermally conductive silicone elastomer is formulated to maximize the thermal and dielectric performance of the filler/binder matrix. These insulators are specifically designed to be used with Vishay's RH Series of Power Resistors.
Bergquist Thermal Clad® is a family of thermally conductive insulated metal substrate (IMS) circuit boards designed to replace conventional FR4 PCBs in LED applications. Designing with Power LEDs is easier with Bergquist standard configurations for the most popular LED profiles. They offer better thermal management, allowing more forward current while keeping the desired die temperatures. Thermal Clad® IMS star or square Substrates from Bergquist are available in single, strip, or array configurations with 10 different LED footprints.
Bergquist Gap Pad® VO Ultimate is an ultra conformable, robust Gap Filling Material ideal for both large and small gap designs. Its construction makes it suitable for manual or automated processes. The material has fiberglass carrier on one side, allowing for ease of rework and puncture resistance. One side has high inherent tack; slight inherent tack on the fiberglass side minimizes shift during assembly. Gap Pad® VO Ultimate from Bergquist has a thermal conductivity rating of 1.3W/m-K.
Gap Pad® VO Ultra Soft from Bergquist is ultra conformable gel-like Gap Filling Material with thermal conductivity of 1.0 W/m-K. For applications requiring a minimum amount of pressure on components, the material gives excellent low-stress vibration dampening and shock absorbency. Bergquist Gap Pad® VO Ultra Soft Gap Filling Material is ideal for isolation between heat sinks and high-voltage, bare-leaded devices.
Bergquist Gap Pad® 3000S30 is a fiberglass-reinforced, soft "S-Class" Gap Filling Material. It features thermal conductivity of 3.0W/m-K which, offering exceptional thermal performance at low pressures. The material is supplied with protective liners on both sides which have naturally inherent tack. Gap Pad® 3000S30 Gap Filling Material from Bergquist is ideal for high-performance, low-stress applications that would typically use fixed standoff or clip mounting. The conformable, yet elastic material offers excellent interfacing and wet-out characteristics.
Gap Pad® 2500S20 from Bergquist is a highly conformable, reinforced Gap Filling Material rated at 2.4W/m-K for thermal conductivity. It features low "S-Class" thermal resistance at ultra-low pressures for applications that typically use fixed standoff or clip mounting. The material is reinforced with fiberglass to resist puncture, shear, and tear. With protective liners provided over the inherent natural tack on both sides, Bergquist's Gap Pad® 2500S20 Gap Filling Material allows for stick-in-place characteristics during application assembly.