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Amphenol TCS (ATCS) is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading high-speed, high-density connectors and backplane systems. Amphenol TCS solves system design challenges with integrated interconnect solutions for application in the networking, communications, storage, and computer server markets.

 
Amphenol Newest Products

Amphenol TCS Product Line

Amphenol TCS New Products

Added 01/2012 Amphenol InfinX™ High Speed Mezzanine Connectors Learn More
Added 01/2012 Amphenol NeXLev® Parallel Board-to-Board Connectors Learn More

Amphenol TCS Featured Products

Amphenol TCS InfinX™ High Speed Mezzanine Connectors

Amphenol TCS InfinX™ High-Speed Mezzanine Connectors are parallel board-to-board connectors capable of supporting data rates up to 25+ Gbps. Optimized for differential signaling, the InfinX High-Speed Mezzanine Connectors feature rugged wafer construction with non-stubbing mating interface and Amphenol's patented "resonance dampening" technology. Developed to meet the demand for increasing bandwidth in mezzanine applications, these connectors are scalable from 10mm to 40mm stack height, and can be selectively loaded with wafers optimized for high-speed differential, single-ended and power.

Amphenol TCS NeXLev® High-Density Parallel Board-to-Board Connectors

Amphenol TCS' NeXLev® product line features High-Density Parallel Board-to-Board Connectors capable of handling data rates up to 12.5 Gbps. Developed to meet the increasing bandwidth requirements in mezzanine applications, NeXLev enables design engineers to relocate high pin count devices onto a mezzanine or module card to simplify board routing and optimize system performance. The robust, damage-resistant design of the Amphenol TCS NeXLev High-Density Parallel Board-to-Board Connectors includes up to 57 real signals per linear centimeter (145 signals per linear inch), ball grid array for precise alignment, a compliant BGA-style attachment to increase SMT process yields, and rugged wafer construction. The wafers can be routed to support either single-ended or differential-paired architectures.