TE Connectivity/ Alcoswitch offers a comprehensive range of switches including DIP switches, slide switches, tactile switches, pushbutton switches, toggle switches, rocker / paddle switches, snap action switches, rotary switches, and keylock switches. In addition to their extensive switch portfolio, TE Connectivity / Alcoswitch also offers a comprehensive range of accessories such as knobs, caps, boot seals and the respective hardware to complete their product offering.

Mouser's TE Connectivity / Alcoswitch Catalog Pages

• TE Connectivity Website
• TE Connectivity Switch Catalog
  
• TE Connectivity Product Compliance Support Center
• TE Connectivity Gemini Series Quick Reference Guide
• TE Connectivity F Series Quick Reference Guide
• TE Connectivity AW Series Quick Reference Guide
• TE Connectivity Quality Policy

• Overview of the Use of Silver in Connector Applications
• A New Simulation Approach to Characterizing the Mechanical and Electrical Qualities of a Connector Contact
• Extension and Experimental Verification of a New 'First Contact' Method to Model Performance of Multilayer Contact Interfaces
• 3 Dimensional Numerical Simulation of Open-Barrel Crimping Process
• Basic Investigations for Switching of RF Signals
• Golden Rules: Guidelines for The Use of Gold on Connector Contacts
• Contact Problems Due to Fretting and Their Solutions
• Avoiding Fretting Corrosion by Design
• Fretting Corrosion in Electric Contacts
• The Tin Commandments: Guidelines for The Use of Tin on Connector Contacts
• Keeping Tin Solderable
• Hot Air Leveled Tin: Solderability and Some Related Properties
• Mateability of Tin to Gold, Palladium and Silver
• Low-Level Contact Resistance Characterization
• Simulation of the Crimping Process by Implicit and Explicit Finite Element Methods
• Analyzing Crosstalk and Ground Bounce in Multiconductor Systems Using SPICE Circuit Simulations
• New Algorithms for Calculating Hertzian Stresses, Deformations, and Contact Zone Parameters
• Metallic Electromigration Phenomena
• Specifying Current for the Real World
  

• Connectors 101: What Lighting Designers Need to Know
• Design of a High Performance Single Beam Contact for Demanding and Long Life Time Applications in Industry and Telecom Markets
• Array Sockets and Connectors Using MicroSpringTM Technology
• Micro ACTION PIN Press-Fit Technology
• Wedge-Connector Technology in Power Utility Applications
• Finite Element Analysis of Compression of Thin, High Modulus Cylindrical Shells with Low Modulus Core
• Analyzing Crosstalk and Ground Bounce in Multiconductor Systems Using SPICE Circuit Simulations
• Shape Optimization of Connector Contacts for Reduced Wear and Reduced Insertion Force
• Calculation of Frequency-Dependent Impedance for Conductors of Rectangular Cross Section
• Brief Overview of Reliability in General and for Electrical Connectors in Particular
• CSR Technology: Flexible Options for Fiber Optics

• A Practical and Reliable Method for Detection of Nanosecond Intermittency
• Correlation Between Measured and Simulated Parameters of a Proposed Transfer Standard
• Estimating and Measuring Thickness of Thin Layers by Monte Carlo Simulation and Backscattered Electron Image Analysis
• Testing for Radiated Emission by Electronic Devices
• Estimation of Uncertainty in Plate Thickness Measurement by X-ray Flourescence Spectrometry

• Effects of Polymer Material Variations on High Frequency Dielectric Properties
• High Temperature Resistant Gold Alloys for Switching Signal Relay Contacts
• Low Halogen Polymers for Electronic Applications
• Tyco Electronics HM-15 Lubricant Stability - Projected Weight Loss
• Uniaxial True Stress - True Strain After Necking
• Desorption of Hydrogen from Palladium Plating
• Cu-Sn Intermetallic Compound Growth in Hot-Air-Leveled Tin at and below 100 degrees C.
• Evaluation of Electroplated Nickel Phosphorous with High Phosphorous Content
• Magnetic Properties and Structure of Cobalt-Hardened Gold
• Connector Design/Materials and Connector Reliability

• Stereolithography and Simultaneous Engineering Speed Products To Market
• Addressing Interconnect Design Challenges in Power Over Ethernet
• "Solder Volumes for Through-Hole Reflow-Compatible Connectors"
• Advances in High Density Optical Interconnects
• Circuit Protection Devices
• High Voltage Relays
• Non-Contact Sensors Technology Overview