Wire-to-board and wire-to-wire system based on insulation displacement contact (IDC) technology.
Includes the SOLISTRAND, PIDG, and Plasti-Grip series of superior performance terminals and splices.
Economical design meets
the needs of less demanding applications in the Industrial, Consumer,
and Datacom industry
Incorporate the DUALOBE polarization scheme that
negates the need for mating guide pins and does not increase the package
Features 3 locking methods including CPA, TPA, and audible lock. High temp housings up to 150°C (302°F).