1-piece integrated design that maintains rear seal at approximately 50% lower cost
than many industry connector/backshells. Requires no field service.
Heavy duty, high-performance, cost-effective solutions for demanding interconnect architectures.
Patented RADSOK® technology; operates at 800vdc to1000vdc with a 300 to 500A rating; 40% smaller footprint.
Thermoplastic, standard or reduced diameter sealing options, IP sealing.