Features a footprint that is up to 50% smaller than SFP+, allowing for increased faceplate density.
Compact pin and socket connectors provide economical solution for high density packages.
Increases port density in panels and provides industry-leading EMI suppression.
Designed to quickly and easily upgrade SFP/SFP+ connectors from current 10-16 Gbps speeds to future 28 Gbps speeds.
Double the port density of low-profile PCIe cards and support 6- and future 12-Gbps SAS applications.