Wire-to-board and wire-to-wire system based on insulation displacement contact (IDC) technology.
Includes the SOLISTRAND, PIDG, and Plasti-Grip series of superior performance terminals and splices.
Economical design meets
the needs of less demanding applications in the Industrial, Consumer,
and Datacom industry
Features 3 locking methods including CPA, TPA, and audible lock. High temp housings up to 150°C (302°F).
Next Generation Grace Inertia Connector to facilitate more stable, reliable and durable connection.