A system-in-package performing at 1.25mA (up to 1.6kHz ODR) in high-performance mode.
3D digital accelerometer and a 3D digital gyroscope that leverages the ST robust and mature manufacturing processes.
Features a 3D digital linear acceleration sensor, a
3D digital angular rate sensor, and a 3D digital magnetic sensor.
System-in-package devices featuring a 3D digital accelerometer and 3D
Provides acceleration values with low noise and minimal power usage.