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NEDA Authorized Advanced Thermal Solutions Distributor

Advanced Thermal Solutions (ATS) has been solving heat issues in electronics for 23 years. They began as a consulting company, and have expanded as the needs for cooling solutions continue to grow. ATS has expanded its role in thermal management consulting and rapid prototyping manufacturing services. ATS develops innovative, higher performance heat sinks and manufactures instruments for improved thermal management studies. Around the world, engineers rely on ATS for their advanced products and services.

 
Advanced Thermal Solutions Newest Products

Advanced Thermal Solutions Product Line

Advanced Thermal Solutions New Products

Added 04/2013 Advanced Thermal Solutions maxiFLOW heatsinks Learn More
Added 04/2013 Advanced Thermal Solutions fanSINK™ Heatsinks Learn More
Added 04/2013 Advanced Thermal Solutions Freescale BGA Heatsinks Learn More
Added 04/2013 Advanced Thermal Solutions maxiGRIP™ Star LED Heatsinks Learn More

Advanced Thermal Solutions Featured Products

ATS maxiGRIP™ Star LED Heatsinks

Advanced Thermal Solutions (ATS) maxiGRIP™ Star LED Heatsinks provide engineers a base heatsink platform to create custom LED heatsink solutions.  ATS maxiGRIP Star LED Heatsinks deliver aluminum heatsink extrusions designed for high heat flux round or star shaped LED elements.  The heatsink material is AL-6063 anodized aluminum for maximum thermal performance.

ATS fanSINK™ Heatsinks

Advanced Thermal Solutions (ATS) fanSINK™ Heatsinks feature omnidirectional air flow for optimum thermal performance independent of PCB layout. ATS fanSINK™ Heatsinks ensure dependable long-term fan to heatsink assembly with stainless screw fan attachments.  The heatsink is attached with ATS maxiGRIP hardware avoiding the need for PCB mounting holes. Includes pre-assembled thermal interface material, fan not included, must be sourced separately.

ATS Freescale BGA Heatsinks

Advanced Thermal Solutions (ATS) Freescale BGA heatsinks are designed for Freescale flip-chip ICs. ATS Freescale BGA heatsinks offer MaxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heatsink comes pre-assembled with high performance phase changing thermal interface material for ease of installation.

ATS maxiFLOW heatsinks

ATS maxiFLOW™ heatsink design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. ATS maxiFLOW™ heatsink features 3 attachment methods, maxiGRIP, thermal tape, or pushpin.  MaxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB. Thermal tape mounts the heatsink to the IC with a thermally conductive adhesive strip.  Pushpin mounting requires holes in the PCB to anchor the heatsink to the IC.