Cortex™-A8 MPUs with high DMIPs and 3D graphics acceleration.
High insulation voltage & high noise immunity, w/ Optoplanar packaging technology.
Industry's smallest 0.8 mm by 0.8 mm chipscale package.
Market-leading dynamic resistance of 0.4Ω for 6 channels of USB 3.0 in μDFN-14 package.